Thin film forming device plasma CVD device
SHINKO SEIKI CO., LTD.
About This Product
It is a large plasma CVD device that supports 600mm board.
It is possible to form a dense silicon oxide film and is suitable for producing thin film capacitors.
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Product
Thin film forming device plasma CVD device
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Handling Company
SHINKO SEIKI CO., LTD.
1 Models of Thin film forming device plasma CVD device
| Product Image | Part Number | Price (excluding tax) | Baseboard heating heater | Film thick distribution | Gas used | Main exhaust vacuum pump | Processable range | RF power supply for discharge | Thickening | operation | processing time | subject |
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Road lock type plasma CVD device |
Available upon quote | Heat temperature 360 ° C ± 10 ° C C (up to 380 ° C) | 560x560 (mm) 7%or less | AR, N2O, SIH4 (AR diluted): Nitrogen (for vent, for purge) | Oil diffusion pump (option: turbo molecular pump) | 600 x 600 (mm) | 13.56MHz (1.5kW) | 15μm (SIO2) | Fully automatic by touch panel | About 4.5 hours / batch (SIO2 15μ μ) | For production |
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About Company Handling This Product
- Japan
- Since 1949