Plasma processing device ICP metal etching device
SHINKO SEIKI CO., LTD.
About This Product
This is the latest type etching device that customizes the configuration and gas system for metal from the basic configuration of the ICP etching device "Serio" for the nano -print mold.
It corresponds to the latest process of semiconductors and MEMS, and realizes the line width of AI and CR nano -level line width.
Compared to substrates other than SI Waeha, compound semiconductors such as sapphire and GaaS compared to the conventional SERIO
･ Compatible with a wide range of substrates and use of wafer, glass for photo masks, and quartz
･ Extracting to full -scale mass production applications in combination with multi -chamber system for achievements is extremely easy
The 8 -inch -wafer -compatible road lock type is the standard, and it is possible to customize the heating stage and the larger chamber according to the process.
By installing multiple etched rooms and the installation of SWP assassing chamber, a consistent etching process of the metal film with high loops can be realized.
We provide the best hard and software for your request through process tests with demo machines within our company.
We will definitely support semiconductors, MEMS, photo masks, high -frequency devices, photonic devices, etc. to mass production.
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Product
Plasma processing device ICP metal etching device
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Handling Company
SHINKO SEIKI CO., LTD.
1 Models of Plasma processing device ICP metal etching device
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ICP metal etching device |
Available upon quote |
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About Company Handling This Product
- Japan
- Since 1949