Thin film forming device multi -buspattting device
SHINKO SEIKI CO., LTD.
About This Product
This is the latest sputter ring device that can be flexible regardless of the substrate or application, such as SI wafer, glass and ceramics.
The R & D Multi -Bath Pattadling device announced in 1991 has evolved into a full -fledged cluster tool that covers the development and prototypes of advanced devices from the accumulated software and flexible hardware.
The STM Series, a crystal of Shinko Seiki's thin film technology, is active in each field, such as semiconductors, FPD, MEMS, and tip surface implementation.
Characteristics of the product
･ Weha base plate (φ76.2 -φ203.2mm) can be processed up to 203mm diagonal or ceramic plate.
･ We have various selection functions that can be used for basic research on future processes or various prototype production.
･ The configuration parts are unitized with emphasis on reliability.
･ Each room independent maintenance is possible, along with the simplicity of maintenance, achieving a shortening of maintenance time and rising time.
-The space -saving and through wall type support high -level clean room use.
* If an etching room is installed, one spatta room will be one room.
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Product
Thin film forming device multi -buspattting device
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Handling Company
SHINKO SEIKI CO., LTD.
3 Models of Thin film forming device multi -buspattting device
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Achievement of each room 压 Power / Spatta room | Achievement of each room 压 Power / etching room | Achievement of each room 压 Power / transport room | Cathode specification / 1st spatta room | Cathode specification / 2nd spatta room | Cathode specification / 3rd spatta room | Cathode specification / 4th Spatta Room | Each room reaches the power / cassette room | Equipment configuration / Sputta room | Equipment configuration / cassette room | Equipment configuration / etching room | Equipment configuration / transport room | Method of operation | Process performance / board heating | Process performance / etching distribution | Process performance / membrane thickening | Processing board | Sputta direction |
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STM5412 |
Available upon quote | 5.0 x 10-⁵ PA or less | 7.0 x 10-⁵ PA or less * 2 | 7.0 x 10-⁵ PA or less | ¢ 200mm x 1 | ¢ 100mm x 3 | - | - | 7.0 x 10-⁵ PA or less | 2 rooms | One room | ※option | One room | Fully automatic CTOC method | 300 ° C | Within ± 10%(¢ 100) * 2 | Within ± 10%(¢ 100) | ¢ 125mm board | up | |
STM5213 |
Available upon quote | 5.0 x 10-⁵ PA or less | 7.0 x 10-⁵ PA or less | 7.0 × 10-⁵ PA or less | ¢ 350mm x 1 | ¢ 350mm x 1 | - | - | 7.0 x 10-⁵ PA or less | 4 rooms | One room | One room | One room | Fully automatic CTOC method | 300 ° C | Within ± 10%(¢ 180) | Within ± 3%(¢ 180) | ¢ 200mm board | up | |
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STM4415 |
Available upon quote | 2.0 x 10-⁵ PA or less | 9.9 x 10-⁶ PA or less | 5.0 x 10-⁵ PA or less | ¢ 300mm x 1 | ¢ 300mm x 1 | ¢ 300mm x 1 | ¢ 300mm x 1 | 9.9 x 10-⁶ PA or less | 4 rooms | One room | One room | One room | Fully automatic CTOC method | 300 ° C | Within ± 10%(¢ 180) | Within ± 5%(¢ 180) | ¢ 200mm board | up |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan
- Since 1949