Thin film formation device wrapping type sputtering device
SHINKO SEIKI CO., LTD.
About This Product
This is the latest RTOR type film model device that realizes not only resin but also metal foil continuous winding processing.
Each mechanism, such as cathode, plasma treatment, and heating mechanism, is unitized and supports a wide range of applications.
* The base material is compatible with various resin film and metal foil.
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Product
Thin film formation device wrapping type sputtering device
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Handling Company
SHINKO SEIKI CO., LTD.
1 Models of Thin film formation device wrapping type sputtering device
| Product Image | Part Number | Price (excluding tax) | Base material thickness | Base material width | Core outer diameter for substrates | Driving speed | Sputta Cathode Preparatory Organization (optional) | Subdivision in the substrate | tension |
|---|---|---|---|---|---|---|---|---|---|
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SDR series |
Available upon quote | 20 ~ 50 µm | 300-1000 mm | 6 "(≒ 150 mm) | 0.5 ~ 20m / min | Up to 4 units | Maximum ¢ 300m | 5 ~ 50kgf / full width |
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About Company Handling This Product
- Japan
- Since 1949