Plasma processing device multi -chamber ICP etching device
SHINKO SEIKI CO., LTD.
About This Product
It is a new multi -chamber type etching device that can equip multiple etching rooms.
Equipped with 2 newly developed ICP etching chamber
･ This device supports not only conventional MEMS process SI deep digging and echoing of quartz but also low -opening sacrifice etching.
･ Compatible with the implication process by the unique SI etching process
･ The new etching process of the device is excellent accuracy and reproducibility by the precise board temperature control mechanism and the wafer lamp mechanism.
･ Equipped with a high -precision etching monitor and manages the etching endpoints of low openings that are not usually detected in real time.
･ Realizes a high -selection ratio etching process according to the membrane type and device structure depending on the temperature and gas ratio
Equipment of different types of processing rooms such as damageless assassing chamber according to the type and process of the device is possible.
This device will greatly improve the mass production process by adopting the new mechanism.
･ Etching object: Si, SIO2, SIC, Sin etc.
･ Compatible wafer size: ~ 8inch wafer
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Product
Plasma processing device multi -chamber ICP etching device
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Handling Company
SHINKO SEIKI CO., LTD.
1 Models of Plasma processing device multi -chamber ICP etching device
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Multi Chamber ICP etching device |
Available upon quote |
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About Company Handling This Product
- Japan
- Since 1949