Winding plasma processing device
SHINKO SEIKI CO., LTD.
About This Product
This is a dedicated system that continuously processed plasma surface treatment of flexible substrates such as resin film and metal foil. Vacuum plasma has a stronger plasma effect.
In particular, it has a great effect on cleaning and hydrophiles on the surface of the resin film, and is used in the mass production process of FPC boards and printer devices.
It is also effective for surface treatment of high -performance fibers such as carbon fiber. It is possible to process fibers and textile shaped products and actively respond to tests.
You can select plasma sources along with the board and application, and you can use the optimal process. The basic configuration of the device is the same as the winding -type sputtering device.
It supports not only various films and fibers, but also thin metal foil, as well as a variety of films and fibers. The plasma mechanism can be equipped on the winding sputtering device.
The mechanism is very effective as a film formation pre -treatment, and can support a wide variety of substrates as a continuous processing device for plasma processing + sputtering.
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Product
Winding plasma processing device
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Handling Company
SHINKO SEIKI CO., LTD.
1 Models of Winding plasma processing device
| Product Image | Part Number | Price (excluding tax) | Discharge electrode | Driving speed | Equipment core outer diameter | Equipment thickness | Equipment width | Equipment winding diameter | tension |
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Winding plasma processing device |
Available upon quote | Up to 4 units | 0.5 to 20 m / min | 0.5 to 20 m / min | 20-50μm | 300-1000 mm | Up to φ300 mm | 5-50kg / f |
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About Company Handling This Product
- Japan
- Since 1949