Thin film formation device lift off process compatible vapor package device
SHINKO SEIKI CO., LTD.
About This Product
This is a dedicated vapor equipment that supports the expanded lift off process.
The verticality of high evaporation particles and the adoption of the substrate water cooling mechanism to protect the register and maintain the fine pattern.
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Product
Thin film formation device lift off process compatible vapor package device
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Handling Company
SHINKO SEIKI CO., LTD.
2 Models of Thin film formation device lift off process compatible vapor package device
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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AAMF-C1650SBR |
Available upon quote |
Aamf-C2265SBR |
Available upon quote |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan
- Since 1949