Thin film forming device super high vacuum sputter ring device
SHINKO SEIKI CO., LTD.
About This Product
It is an ultra -high vacuum compatible sputtering device with a 10 -PA background exhaust performance in the spatta room.
It consists of 6 rooms in the road rock room, cassette room, transport room, and sputter room, and can be used in a multilayer film in ultra -high and air. It is extremely effective for developing magnetic devices and compounds.
【feature】
･ For research and development of state -of -the -art devices such as magnetic devices, nitride, and oxide semiconductors
･ The latest multi -chamber system compatible with up to φ8 inchwayha
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Product
Thin film forming device super high vacuum sputter ring device
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Handling Company
SHINKO SEIKI CO., LTD.
1 Models of Thin film forming device super high vacuum sputter ring device
| Product Image | Part Number | Price (excluding tax) | Achievement of each room / Road Lock Room | Achievement of each room 压 Power / Spatta room | Achievement of each room 压 Power / transport room | Cathode specifications | Each room reaches the power / cassette room | Equipment configuration / Sputta room | Equipment configuration / cassette room | Equipment configuration / road rock room | Equipment configuration / transport room | Method of operation | Process performance / board heating | Process performance / etching distribution | Process performance / membrane thickening | Processing board | Sputta direction |
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STM2323 |
Available upon quote | 8.0 x 10-⁶ PA or less | 1.0 x 10-⁶ PA or less | 1.0 x 10-⁷ PA or less | RMC | 4.0 x 10-⁶ PA or less | 3 rooms | One room | One room | One room | Fully automatic CTOC method | 500 ° C | Within ± 10%(¢ 65) | Within ± 5%(¢ 65) | Maximum ¢ 100mm | down |
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About Company Handling This Product
- Japan
- Since 1949