Price (excluding tax)
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Achievement of each room 压 Power / Spatta room
Achievement of each room 压 Power / etching room
Achievement of each room 压 Power / transport room
Cathode specification / 1st spatta room
Cathode specification / 2nd spatta room
Each room reaches the power / cassette room
Equipment configuration / Sputta room
Equipment configuration / cassette room
Equipment configuration / etching room
Equipment configuration / transport room
Method of operation
Process performance / board heating
Process performance / etching distribution
Process performance / membrane thickening
Processing board
Sputta direction
Cathode specification / 3rd spatta room
Cathode specification / 4th Spatta Room
Part Number
STM5412Handling Company
SHINKO SEIKI CO., LTD.Items marked with have different values depending on the model number.
Product Image | Price (excluding tax) | Achievement of each room 压 Power / Spatta room | Achievement of each room 压 Power / etching room | Achievement of each room 压 Power / transport room | Cathode specification / 1st spatta room | Cathode specification / 2nd spatta room | Each room reaches the power / cassette room | Equipment configuration / Sputta room | Equipment configuration / cassette room | Equipment configuration / etching room | Equipment configuration / transport room | Method of operation | Process performance / board heating | Process performance / etching distribution | Process performance / membrane thickening | Processing board | Sputta direction |
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Available upon quote | 5.0 x 10-⁵ PA or less | 7.0 x 10-⁵ PA or less * 2 | 7.0 x 10-⁵ PA or less | ¢ 200mm x 1 | ¢ 100mm x 3 | 7.0 x 10-⁵ PA or less | 2 rooms | One room | ※option | One room | Fully automatic CTOC method | 300 ° C | Within ± 10%(¢ 100) * 2 | Within ± 10%(¢ 100) | ¢ 125mm board | up |