Sputter device for FE-SEM tungsten coat MSP-20-TK
Vacuum device
About This Product
Magnetron Patta device is applied to promote ionization on the cathode surface layer using a powerful magnet on the back of the target, and apply a metal molecule to collide with a magnetic field by a magnetic field.
Precious metals such as gold and platinum are used mainly for electron microscopes. In addition, we have a lineup of top models that can spat other metal targets.
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Product
Sputter device for FE-SEM tungsten coat MSP-20-TK
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Handling Company
Vacuum device
1 Models of Sputter device for FE-SEM tungsten coat MSP-20-TK
| Product Image | Part Number | Price (excluding tax) | Achievement vacuum | Advanced voltage/current | Chamber size | Device size | Exhaust system | Introduction of atmosphere gas | Safety measure | Sample size | Sample stage | Target -sample interval | Target metal | power supply | shutter | target | timer |
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MSP-20-TK |
Available upon quote | 1 (PA) or less | Voltage DC0 ~ 500V/current DC0-200mA | Inner diameter 149mm, depth 126mm | Body W354mm x D368mm x H43022kg | External RP50ℓ/min14.6kg | 1/4 'introduced pipe, 0.07MPa or less. | Fuses by system, upper lid open sensor | Diameter ≦ φ45mm, height: 30 m m | φ47mm floating system | 50-70mm | Standard: W, Options: MO/CR/Ni/Ta/Cu/Ti/(thickness 1mm) Precious metal: au/au-pd/PT/PT-PD/AG (thickness 0.5mm) | AC100V, 15A with ground wire 3m used 3m | A shutter standard attached for press padta | φ50 m M air -cooled magnetron | OMRON's electronic timer |
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