Product
Multi -unit sputtering device equipped with a unique spatta catsHandling Company
Japan Create Co., Ltd.Product Image | Part Number | Price (excluding tax) | Board size | Board stage | Control operation | Data logging | Pressure control | Process gas | Spatta power supply | Sputta Cathode | Transportation of the board | Vacuum exhaust | option |
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Multi -unit sputtering device |
Available upon quote | Maximum φ12 inch |
Bachelon heating: 700 ° C (substrate surface) Rotation: 30rpm Open Rid: 10RPM Railway: 50mmst |
Control: PLC Operation: Touch panel or PC |
External memory or PC | APC control | AR, O2, N2, etc. | RF or DC | Magnetron method, target shutter | Vacuum transport robot |
Configuration 1: TMP+DP Configuration 2: CP+DP |
Bachelon heating 900 ° C, board bias (RF or DC), substrate cooling (low-temperature film), moving magnet, magnetic material target cathode, light emitting analysis system, tray transport, Q-MASS ETC |