Multi -chamber -type sputtering device S800-S800
Multi -chamber -type sputtering device S800-Panasonic Production Engineering Co., Ltd.

Multi -chamber -type sputtering device S800
Panasonic Production Engineering Co., Ltd.


About This Product

■ Features ・ Multi -chamber type and support a wide variety of processes ・ The unit of our S600 device can be installed ・ Maintenance of long -term hyperchd and uniformity by adjusting T/S distance ・ Improve spatta thin film characteristics with proprietary plasma control (MP spatta) technology ・ High temperature process is possible with a heater stage (800 ° C) ・ It can be used for various applications from development process to mass production process ■ A variety of units can be mounted ・ Realizes high productivity in the double load lock room ・ Compatible with φ4 to 8 inch substrates (supported by tray transport to variant substrates such as small shapes and rectangles) ・ Various units can be mounted on each process module ・ DC/RF cathode ・ MP spatta (proprietary technology) ・ AR cleaning ・ Reverse spatta ・ Baseboard, substrate heating ・ substrate heating ・ Chimney cooling ■ Sputta Cathode ・ A large -diameter wide erotic due to biased spinning magnet achieves a high -precision film thickness and long life of the target. ・ The magnetic field design is designed by us by our company to maximize customer requests. ■ T/S adjustment mechanism Maintain high uniformity of film thickness to the target life by automatically adjusting the T/S distance change due to target erosion. ■ MP Spatta ・ With unique plasma control technology, the DC magnetron patta method (1) high energy of spatta particles (2) high -density of active species (3) Realize migration promotion of particles on the substrate. ・ Film film such as high crystals/high -direction -oriented functions, high -density/high moisture -resistant protection film, low -resistance metal film, etc., which are essential for miniaturization and high performance of electronic components

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    Multi -chamber -type sputtering device S800




*Please note that we may not be able to accommodate sample requests.

1 Models of Multi -chamber -type sputtering device S800

Product Image Part Number Price (excluding tax) Number of process modules Process gas species Supported board size Target size
Multi -chamber -type sputtering device S800-Part Number-S800

S800

Available upon quote Max. 3 rooms AR, N2, O2 φ4 ~ φ8 inch φ200, φ250, φ300, φ350, φ400mm

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About Company Handling This Product

Panasonic Production Engineering Co., Ltd.

  • Japan
  • Since 2014
  • 657 employees

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