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Thin film forming device batch sputtering deviceHandling Company
SHINKO SEIKI CO., LTD.Categories
Click on the part number for more information about each product
| Image | Part Number | Price (excluding tax) | Processing board | Target / Cathode type | Target / Size x number | Sputta direction | Base platform / rotation mechanism | Base board / substrate heating | Base platform / membrane thick distribution | Exhaust system / Achievement power | Exhaust system / exhaust time | Exhaust system / main pump | Operation method / exhaust operation | Operation method / film formation operation | Sputta power supply / RF | Spatta power supply / DC | Gas introduction system |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
SRV4310 |
Available upon quote |
¢ 320mm |
Plena magnetron |
¢ 100mm x 3 |
up |
◯ |
300 ° C on the board stand |
Within ± 10%(¢ 210) |
6.0 x 10-⁵ PA or less |
9.9 X 10-⁴ PA within 10 minutes |
Cry -pump |
Automatic |
Half -automatic (timer type) |
500W |
option |
Two systems |
SRV6310 |
Available upon quote |
¢ 320mm |
Plena magnetron |
¢ 150mm x 3 |
up |
◯ |
300 ° C on the board stand |
Within ± 10%(¢ 300) |
6.0 x 10-⁵ PA or less |
9.9 X 10-⁴ PA within 10 minutes |
Cry -pump |
Automatic |
Half -automatic (timer type) |
1kw |
option |
Two systems |
|
SRV7310 |
Available upon quote |
¢ 520mm |
RMC |
¢ 200mm x 3 |
up |
◯ |
300 ° C on the board stand |
Within ± 10%(¢ 420) |
6.0 x 10-⁵ PA or less |
9.9 X 10-⁴ PA within 10 minutes |
Cry -pump |
Automatic |
Half -automatic (timer type) |
3kw |
option |
Two systems |
Click on the part number for more information about each product
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Reviews shown here are reviews of companies.
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