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Thin film forming device multi -buspattting deviceHandling Company
SHINKO SEIKI CO., LTD.Categories
Image | Part Number | Price (excluding tax) | Processing board | Equipment configuration / cassette room | Equipment configuration / transport room | Equipment configuration / etching room | Equipment configuration / Sputta room | Cathode specification / 1st spatta room | Cathode specification / 2nd spatta room | Sputta direction | Process performance / membrane thickening | Process performance / etching distribution | Process performance / board heating | Each room reaches the power / cassette room | Achievement of each room 压 Power / transport room | Achievement of each room 压 Power / etching room | Achievement of each room 压 Power / Spatta room | Method of operation | Cathode specification / 3rd spatta room | Cathode specification / 4th Spatta Room |
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Reviews shown here are reviews of companies.