Thin film forming device multi -buspattting device-STM4415

Thin film forming device multi -buspattting device
SHINKO SEIKI CO., LTD.

About This Product

This is the latest sputter ring device that can be flexible regardless of the substrate or application, such as SI wafer, glass and ceramics.

The R & D Multi -Bath Pattadling device announced in 1991 has evolved into a full -fledged cluster tool that covers the development and prototypes of advanced devices from the accumulated software and flexible hardware.

The STM Series, a crystal of Shinko Seiki's thin film technology, is active in each field, such as semiconductors, FPD, MEMS, and tip surface implementation.

Characteristics of the product
･ Weha base plate (φ76.2 -φ203.2mm) can be processed up to 203mm diagonal or ceramic plate.
･ We have various selection functions that can be used for basic research on future processes or various prototype production.
･ The configuration parts are unitized with emphasis on reliability.
･ Each room independent maintenance is possible, along with the simplicity of maintenance, achieving a shortening of maintenance time and rising time.
-The space -saving and through wall type support high -level clean room use.

* If an etching room is installed, one spatta room will be one room.

Model
There are 3 models for this product.

Product
Thin film forming device multi -buspattting device

Handling Company
SHINKO SEIKI CO., LTD.

Categories

Machining / Machine Tools

Sputtering Equipment

310+ people viewing

Last viewed: 7 hours ago

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3 Models of Thin film forming device multi -buspattting device

Click on the part number for more information about each product

Part Number	Price (excluding tax)	Processing board	Equipment configuration / cassette room	Equipment configuration / transport room	Equipment configuration / etching room	Equipment configuration / Sputta room	Cathode specification / 1st spatta room	Cathode specification / 2nd spatta room	Sputta direction	Process performance / membrane thickening	Process performance / etching distribution	Process performance / board heating	Each room reaches the power / cassette room	Achievement of each room 压 Power / transport room	Achievement of each room 压 Power / etching room	Achievement of each room 压 Power / Spatta room	Method of operation	Cathode specification / 3rd spatta room	Cathode specification / 4th Spatta Room
STM5412	Available upon quote	¢ 125mm board	One room	One room	※option	2 rooms	¢ 200mm x 1	¢ 100mm x 3	up	Within ± 10%(¢ 100)	Within ± 10%(¢ 100) * 2	300 ° C	7.0 x 10-⁵ PA or less	7.0 x 10-⁵ PA or less	7.0 x 10-⁵ PA or less * 2	5.0 x 10-⁵ PA or less	Fully automatic CTOC method	-	-
STM5213	Available upon quote	¢ 200mm board	One room	One room	One room	4 rooms	¢ 350mm x 1	¢ 350mm x 1	up	Within ± 3%(¢ 180)	Within ± 10%(¢ 180)	300 ° C	7.0 x 10-⁵ PA or less	7.0 × 10-⁵ PA or less	7.0 x 10-⁵ PA or less	5.0 x 10-⁵ PA or less	Fully automatic CTOC method	-	-
STM4415	Available upon quote	¢ 200mm board	One room	One room	One room	4 rooms	¢ 300mm x 1	¢ 300mm x 1	up	Within ± 5%(¢ 180)	Within ± 10%(¢ 180)	300 ° C	9.9 x 10-⁶ PA or less	5.0 x 10-⁵ PA or less	9.9 x 10-⁶ PA or less	2.0 x 10-⁵ PA or less	Fully automatic CTOC method	¢ 300mm x 1	¢ 300mm x 1

Click on the part number for more information about each product

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About Company Handling This Product

SHINKO SEIKI CO., LTD.

Company Overview

SHINKO SEIKI CO., LTD., established in 1949, and located in Kobe, Japan, is a manufacturer of vacuum devices, ...

Japan

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Thin film forming device multi -buspattting device SHINKO SEIKI CO., LTD.

About This Product

3 Models of Thin film forming device multi -buspattting device

STM5412

STM5213

STM4415

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About Company Handling This Product

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Thin film forming device multi -buspattting device
SHINKO SEIKI CO., LTD.