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  4. Pressure film forming sputtering device (Japan Create Co., Ltd.)
Pressure film forming sputtering device-Pressure film forming sputtering device
Pressure film forming sputtering device-Japan Create Co., Ltd.

Pressure film forming sputtering device
Japan Create Co., Ltd.

🧪 Chemical Industry Use 💻 Electronics & Electrical Use

Japan Create Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

185.3hours

Company Review

5.0

About This Product

■ Characteristics

・ Continuous film is possible from single crystal epitaxial buffer layer to piezoelectric membrane ・ Elementary detection that contributes to a decrease in piezoelectric characteristics by installing a plasma emission monitor ・ Deposition structure that maximizes the axle length that contributes to piezoelectric power ・ Equipped with our own spatta cathode ・ It also supports moving magnets and can be fully erotic ・ Equipped with our own rapid rising temperature drop board heating mechanism and realizes the board temperature of 900 ° C. ・ High -speed and stable reactive spatta film formation is possible by plasma analysis and feedback control by light emission analysis system. ・ Trail transport is also available ・ Combination of CVD rooms, vapor rooms, plasma blacking rooms, etc. is also available

■ Use

·semiconductor ・ MEMS ・ Electronic components ・ Optical parts ・ In -vehicle parts

  • Product

    Pressure film forming sputtering device

  • Usage Scenarios

    Chemical Industry Use / Electronics & Electrical Use

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1 Models of Pressure film forming sputtering device

Image Part Number Price (excluding tax)
Pressure film forming sputtering device-Part Number-Pressure film forming sputtering device

Pressure film forming sputtering device

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About Company Handling This Product

Japan Create Co., Ltd.

Response Rate

100.0%

Response Time

185.3hrs

Company Review

5.0
  • Japan

Related search keywords

Deposition Equipment
Deposition Equipment　Japan Create Co., Ltd.
Japan Create Co., Ltd.

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