This product is registered by SHINKO SEIKI CO., LTD..
About This Product
The surface wave plasma (SWP), which can generate a large area of high -density plasma, is used for many purposes such as assing and surface treatment.
You can do damageless cleaning by H2 radical.
Product features
･ Applying a surface wave plasma that can form a uniform high -density plasma in a large area, has been delivered as an assessing or CVD device.
･ High -rate assassing is possible with damageless
SWP application field
･ Semiconductor wafer process / assessing
High rate = 300mm wafer 2 μm/min or more
Damageless = Completely expeled to charge up damage by completely downflow method
･ FPD manufacturing process / Organic layer removal (including assessing)
Removes the arrangement film on the panel with a radical generated by high -density plasma, supports the manufacturing process of large FPDs
･ MEMS manufacturing process
Organic film etching = fully removed sacrifice layer by organic film
Plasma etching = SWP plasma combined with RF bias on the substrate side to etching various thin films
･ Others / Plasma CVD use
It is adapted for research such as solar cells, taking advantage of the uniform plasma distribution to a large area. We can expect new applications in the future.
This is the version of our website addressed to speakers of English in
the United States.
If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.
