Powdered body processing rotary table vacuum plasma device YHS-Dφs-YHS-Dφs
Powdered body processing rotary table vacuum plasma device YHS-Dφs-SAKIGAKE-Semiconductor

Powdered body processing rotary table vacuum plasma device YHS-Dφs
SAKIGAKE-Semiconductor


About This Product

Ideal for processing powder and chip capacitors. A rotating mechanism has been added to the vacuum plasma so that the entire surface can be processed at once. ■ Product overview ・ High processing effect for surface modification / cleaning / hydrophilic treatment ・ Batch processing of the front and back by rotating chamber ・ The surface treatment of the powder is possible in the dry environment ・ Distribute rotating tubular electrodes in the chamber ・ Discharge high -frequency to the electrode in the center facing cylindrical electrodes -The processing work rolls in the rotating chamber and can be processed in front and back lump. ・ Washing resin -produced products ・ Washing pre -treatment MEMS cleaning, etc. ・ Etching of powder and small parts for powdered surface treatment in a dry environment ・ Light film formation ・ Water repelliation ・ Reduction oxidation.

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    Powdered body processing rotary table vacuum plasma device YHS-Dφs




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1 Models of Powdered body processing rotary table vacuum plasma device YHS-Dφs

Product Image Part Number Price (excluding tax) External dimensions Gas control method Gas system Rotation part power supply weight
Powdered body processing rotary table vacuum plasma device YHS-Dφs-Part Number-YHS-Dφs

YHS-Dφs

Available upon quote 820mm (W) x 600mm (d) x 680mm (H) Needle valve (mass flow controller is optional) 1 system (2 or more systems are optional) φ210 × 200mm (d) 100V, 30A (50Hz/60Hz) 100kg

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