Attotive pressure (remote) Low-temperature pen type air pressure plasma device Barrier-20
SAKIGAKE-Semiconductor
About This Product
Attached plasma processing at lower temperature and lower flow at low flow.
Surface modification: In a atmospheric pressure environment, plasma without charge damage is generated stably.
■ Product overview
･ There is almost no damage due to heat.
･ It can be used in various gases such as air, nitrogen, AR, HE.
･ Because it operates with an AC100V outlet, it can be used in various situations.
･ It can also be used as a lab device.
･ Dimensions (including protrusions) (mm) 260 (W) × 280 (d) × 139 (H)
･ Maintenance is also easy.
･ Improvement of wetness (application / adhesive pre -treatment)
･ For surface cleaning such as metal, glass, resin, film, fiber (organic matter removal)
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Product
Attotive pressure (remote) Low-temperature pen type air pressure plasma device Barrier-20
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Handling Company
SAKIGAKE-Semiconductor
1 Models of Attotive pressure (remote) Low-temperature pen type air pressure plasma device Barrier-20
| Product Image | Part Number | Price (excluding tax) | External dimensions (plasma pen) | Flow rate adjustment | Gas used | Output adjustment | function | power supply |
|---|---|---|---|---|---|---|---|---|
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Barrier-20 |
Available upon quote | φ25mm x 122mm | none | N2 / AR / HE ・ Air (modification may be required according to gas) | can be | Processing time timer | 100V, 5A (50Hz/60Hz) |
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