Attotive pressure (direct) Attotive pressure liquid powder plasma processing device ASS-400
SAKIGAKE-Semiconductor
About This Product
Mix with liquid by surface treatment of powder without a surfactant.
Preparation: Filer preprocessing, baked powder pretreatment.
Others: For the development of hybrid material.
■ Product features
･ We have eliminated unnecessary equipment and achieve excellent cost performance by making it a simple equipment configuration.
･ Because it is a windless process, the powder does not scatter.
･ Mix the flour and liquid that were not mixed at all.
■ Main use
Excellent features of powdered plasma processing
･ Carbon powder such as carbon nanotube (with a track record)
･ Paints of water -soluble ink
･ Filler preprocessing
･ Preparing for firing powder
･ Other ideal for basic research applications in each field.
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Product
Attotive pressure (direct) Attotive pressure liquid powder plasma processing device ASS-400
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Handling Company
SAKIGAKE-Semiconductor
1 Models of Attotive pressure (direct) Attotive pressure liquid powder plasma processing device ASS-400
| Product Image | Part Number | Price (excluding tax) | Built -in mechanism | Outer diameter dimensions | Processing pressure (room temperature) | Voltage | utility |
|---|---|---|---|---|---|---|---|
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ASS-400 |
Available upon quote | Stirring, power adjustment, timer | 450 (W) 300 (d) 630 (H) | 1ATM = 760TORR level (atmospheric pressure) | Frequency: 15kV/50/60Hz | Single -phase 100V/50/60Hz/5.0A |
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