Powder treatment Small rotation type vacuum plasma device MUG-80-MUG-80
Powder treatment Small rotation type vacuum plasma device MUG-80-SAKIGAKE-Semiconductor

Powder treatment Small rotation type vacuum plasma device MUG-80
SAKIGAKE-Semiconductor


About This Product

■ Product overview ・ Introduced a rotating stirring mechanism in the vacuum chamber ・ Dry type and full -length processing ・ Stir during glow discharge to ensure high uniformity ・ Because of the rotation type, there is no need to reit the small parts such as chip. ・ Etching of powder and small parts, thin film formation, water repelliation, oxidation reduction

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    Powder treatment Small rotation type vacuum plasma device MUG-80




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1 Models of Powder treatment Small rotation type vacuum plasma device MUG-80

Product Image Part Number Price (excluding tax) External dimensions Gas control method Gas system Pressure adjustment Rotation part power supply weight
Powder treatment Small rotation type vacuum plasma device MUG-80-Part Number-MUG-80

MUG-80

Available upon quote 400mm (W) x 353mm (d) x 340mm (H) option option option φ80 × 42mm (D) 100V, 15A (50Hz/60Hz) 30kg

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