All Categories
History
Product
Thin film formation device wrapping type sputtering deviceHandling Company
SHINKO SEIKI CO., LTD.Categories
Image | Part Number | Price (excluding tax) | Base material width | Base material thickness | Subdivision in the substrate | Core outer diameter for substrates | Driving speed | tension | Sputta Cathode Preparatory Organization (optional) |
---|
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.