All Categories
History
Product
Thin film formation device wrapping type sputtering deviceHandling Company
SHINKO SEIKI CO., LTD.Categories
Image | Part Number | Price (excluding tax) | Base material width | Base material thickness | Subdivision in the substrate | Core outer diameter for substrates | Driving speed | tension | Sputta Cathode Preparatory Organization (optional) |
---|---|---|---|---|---|---|---|---|---|
SDR series |
Available upon quote |
300-1000 mm |
20 ~ 50 µm |
Maximum ¢ 300m |
6 "(≒ 150 mm) |
0.5 ~ 20m / min |
5 ~ 50kgf / full width |
Up to 4 units |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.