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Thin film forming device batch sputtering device-SHINKO SEIKI CO., LTD.

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Base board / substrate heating

Base platform / membrane thick distribution

Base platform / rotation mechanism

Exhaust system / Achievement power

Exhaust system / exhaust time

Exhaust system / main pump

Gas introduction system

Operation method / exhaust operation

Operation method / film formation operation

Processing board

Spatta power supply / DC

Sputta direction

Sputta power supply / RF

Target / Cathode type

Target / Size x number

See all 3 models in list
  • Part Number

    SRV4310

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Thin film forming device batch sputtering device SRV4310's performance table

Image Price (excluding tax) Base board / substrate heating Base platform / membrane thick distribution Base platform / rotation mechanism Exhaust system / Achievement power Exhaust system / exhaust time Exhaust system / main pump Gas introduction system Operation method / exhaust operation Operation method / film formation operation Processing board Spatta power supply / DC Sputta direction Sputta power supply / RF Target / Cathode type Target / Size x number
Thin film forming device batch sputtering device-Part Number-SRV4310 Available upon quote 300 ° C on the board stand Within ± 10%(¢ 210) 6.0 x 10-⁵ PA or less 9.9 X 10-⁴ PA within 10 minutes Cry -pump Two systems Automatic Half -automatic (timer type) ¢ 320mm option up 500W Plena magnetron ¢ 100mm x 3

There are 3 models for this product.

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About Company Handling This Product

Company Overview

SHINKO SEIKI CO., LTD., established in 1949, and located in Kobe, Japan, is a manufacturer of vacuum devices, ...

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  • Japan

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