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  4. Thin film formation device lift off process compatible vapor package device (SHINKO SEIKI CO., LTD.)
Thin film formation device lift off process compatible vapor package device-AAMF-C1650SBR
Thin film formation device lift off process compatible vapor package device-SHINKO SEIKI CO., LTD.

Thin film formation device lift off process compatible vapor package device
SHINKO SEIKI CO., LTD.

About This Product

This is a dedicated vapor equipment that supports the expanded lift off process. The verticality of high evaporation particles and the adoption of the substrate water cooling mechanism to protect the register and maintain the fine pattern.

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    Thin film formation device lift off process compatible vapor package device

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2 Models of Thin film formation device lift off process compatible vapor package device

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Thin film formation device lift off process compatible vapor package device-Part Number-AAMF-C1650SBR

AAMF-C1650SBR

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Aamf-C2265SBR

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About Company Handling This Product

SHINKO SEIKI CO., LTD.

Company Overview

SHINKO SEIKI CO., LTD., established in 1949, and located in Kobe, Japan, is a manufacturer of vacuum devices, ...

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  • Japan

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Vacuum Vapor Deposition Devices
Vacuum Vapor Deposition Devices　SHINKO SEIKI CO., LTD.
SHINKO SEIKI CO., LTD.

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