This product is registered by SHINKO SEIKI CO., LTD..
About This Product
A plasma surface treatment device that uses a parasma of a parallel flat plate type RIE method that enables treatment such as cleaning, reduction, and oxidation of the substrate surface.
By changing the processing mode and processing gas, it supports a wide range of applications.
There are two models: a 450 x 450mm large substrate compatible device and a 250 x 250mm small substrate compatible device according to the board size.
Characteristics of the product
･ Large area processing of 8 inches or more is possible with a compact housing
･ Powerful for hydrophilic treatment before implementation and removing organic matter and oxide film
･ Ideal for surface treatment of resin substrate
･ You can select a hard mode with good processing and a soft mode that takes into account the damage to the substrate.
Mechanism of surface treatment
･ Ideal for removing organic dirt using Aeon's chemical reaction power
･ Physically removing dirt on the surface using the spatta power of ions
･ Use oxygen ions to uniformly oxidize the substrate (metal) surface.
･ Use hydrogen ions to remove the substrate (metal) surface oxide film
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