This product is registered by SHINKO SEIKI CO., LTD..
About This Product
SERIO is a high -density plasma etched device equipped with high density ICP plasma sauce. The proprietary development process has achieved high vertical and smoothness on the etching surface.
It is a system configuration that is ideal for high -aspect etching in the electronic field to MEMS and nano -printed fields.
Product features
･ High -density ICP plasma sauce high -density etching device that achieves a smooth etching surface
･ Excellent control of the etching angle, ideal for making nano -print molds
SWP application field
･ Semiconductor wafer process
･ Assessing
･ High rate = 300mm wafer 2 μm/min or more
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