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  4. Winding plasma processing device (SHINKO SEIKI CO., LTD.)

Winding plasma processing device
SHINKO SEIKI CO., LTD.

About This Product

This is a dedicated system that continuously processed plasma surface treatment of flexible substrates such as resin film and metal foil. Vacuum plasma has a stronger plasma effect. In particular, it has a great effect on cleaning and hydrophiles on the surface of the resin film, and is used in the mass production process of FPC boards and printer devices. It is also effective for surface treatment of high -performance fibers such as carbon fiber. It is possible to process fibers and textile shaped products and actively respond to tests. You can select plasma sources along with the board and application, and you can use the optimal process. The basic configuration of the device is the same as the winding -type sputtering device. It supports not only various films and fibers, but also thin metal foil, as well as a variety of films and fibers. The plasma mechanism can be equipped on the winding sputtering device. The mechanism is very effective as a film formation pre -treatment, and can support a wide variety of substrates as a continuous processing device for plasma processing + sputtering.

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    Winding plasma processing device

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0 Models of Winding plasma processing device

Image Part Number Price (excluding tax) Equipment width Equipment thickness Equipment winding diameter Equipment core outer diameter Driving speed tension Discharge electrode

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About Company Handling This Product

SHINKO SEIKI CO., LTD.

Company Overview

SHINKO SEIKI CO., LTD., established in 1949, and located in Kobe, Japan, is a manufacturer of vacuum devices, ...

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  • Japan

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Plasma Processing Equipment
Plasma Processing Equipment　SHINKO SEIKI CO., LTD.
SHINKO SEIKI CO., LTD.

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