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Base board / substrate heating

Base board / transport method

Base platform / membrane thick distribution

Base platform / rotation mechanism

Exhaust system / Achievement power

Exhaust system / exhaust time

Exhaust system / main pump

Gas introduction system

Operation method / Transportation operation

Operation method / exhaust operation

Operation method / film formation operation

Processing board

Spatta power supply / DC

Sputta direction

Sputta power supply / RF

Target / Cathode type

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  • Part Number

    SDL4320

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Sputtering device for thin film formation equipment research and development SDL4320's performance table

Image Price (excluding tax) Base board / substrate heating Base board / transport method Base platform / membrane thick distribution Base platform / rotation mechanism Exhaust system / Achievement power Exhaust system / exhaust time Exhaust system / main pump Gas introduction system Operation method / Transportation operation Operation method / exhaust operation Operation method / film formation operation Processing board Spatta power supply / DC Sputta direction Sputta power supply / RF Target / Cathode type Target / Size x number
Available upon quote 300 ° C on the board stand Transfer rod Within ± 10%(¢ 180) 8.0 x 10-⁵ PA or less 5.0 x 10-⁴ PA within 20 minutes Turbo molecular pump Two systems Manual Automatic Half -automatic (timer type) ¢ 200mm x 1 sheet 3kw up option Plena magnetron ¢ 100mm x 3

There are 6 models for this product.

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About Company Handling This Product

Company Overview

SHINKO SEIKI CO., LTD., established in 1949, and located in Kobe, Japan, is a manufacturer of vacuum devices, ...

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  • Japan

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