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This section provides an overview for thermal resins as well as their applications and principles. Also, please take a look at the list of 17 thermal resin manufacturers and their company rankings. Here are the top-ranked thermal resin companies as of September, 2026: 1.Shin-Etsu Chemical Co., Ltd., 2.Wakefield Thermal, Inc., 3.Tokuyama Corporation.
Table of Contents
Categories Related to Thermal Resins
Thermal Resins are resins with high thermal conductivity (ease of heat transfer in a solid).
In recent years, electronic devices have been rapidly increasing in performance, integration, and miniaturization. This has led to an increase in the amount of heat dissipated from electronic devices, and the heat dissipation performance of electronic devices has become an issue.
Thermal Resins can be used in such electronic devices to improve their heat dissipation performance. Polycarbonate resin, polybutylene terephthalate resin, polyacetal resin, and nylon resin are currently available as Thermal Resins.
Thermal Resins are increasingly used in fields where high heat dissipation performance is required. Examples include use in various electronic devices, office automation equipment, IT equipment, LED components, and sensor components.
Power semiconductors used to control electric vehicles are another application. This is because power semiconductors generate a lot of heat due to high heat loss and must efficiently dissipate heat when in use. Packaging power semiconductors in Thermal Resin improves heat dissipation from the semiconductor chips.
Thermal Resin is produced by blending a Thermal Resin with a Thermal Conductive Filler (e.g. Graphite). When thermally conductive filler is blended, a thermal conductive path consisting of thermally conductive filler is formed inside the resin, and the heat generated inside is dissipated to the outside through this thermal conductive path. This is the reason why the heat dissipation performance of the resin is improved.
However, if Thermal Resin fillers are not in contact with each other inside the resin, no thermal path is naturally formed. Therefore, depending on how the thermally conductive filler is formulated, it may fail to provide thermal conductivity.
In some cases, adding a large amount of Thermal Resin filler will impair the processability of the resin, so another additive is added to add fluidity to the resin.
Silicon resin is a type of polymer composed mainly of silicon and oxygen atoms. It has very high heat resistance, usually reaching temperatures of 200°C or higher, and some special grades can withstand temperatures of 300°C or higher. Silicone resins are extremely flexible and have high chemical resistance.
They also feature excellent electrical insulation and weather resistance. Because of these characteristics, they are widely used in heat sinks for electronic devices and LED lighting, insulation materials for electrical components, and heat-resistant seals.
Polyamide resin is a type of polymer formed by the reaction of amines and carboxylic acids, commonly known as nylon. Polyamide resin has high heat resistance, with some special grades having a heat resistance temperature of 300°C or higher.
They also have excellent chemical resistance and high mechanical strength. Because of these characteristics, they are often used in automotive parts, cooling fins for industrial machinery, and cooling materials for electrical and electronic equipment.
Polycarbonate resin is a polymer with excellent heat resistance and transparency. Its high heat resistance allows it to withstand temperatures of 100°C or higher.
In addition to applications requiring optical transparency, it can be widely used for LED lighting, cases for electronic devices, and heat sinks that need to dissipate heat. It also has excellent impact resistance, making it suitable for sturdy products.
Polyester resins have high heat resistance, typically with a heat resistance temperature of 100°C or higher, although some special grades can withstand temperatures of 150°C or higher. These resins also have excellent chemical resistance and abrasion resistance.
Widely used in cooling materials for electrical and electronic equipment, power supply components, automotive parts, and insulation materials for industrial machinery.
Acrylic resins have excellent transparency and some types have high Thermal Resin. Typical heat resistance temperatures range from 80°C to 100°C, but some special grades with high thermal conductivity can reach 150°C or higher.
Widely used mainly as lenses for LED lighting and optical materials, some high thermal conductivity types are also used for heat dissipation applications.
*Including some distributors, etc.
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Wakefield Thermal, Inc., founded in 1957 with headquarters in the USA, is a manufacturer of thermal management equipment, accessories, and systems. The company's products include thermal extrusions, LED heat sinks, heat frames and pipes, fans, and heat exchangers. Wakefield Thermal serves various industries, including power conversion, information technology, renewable energy, telecommunications, and transportation markets. The company also offers end-to-end custom thermal engineering and production solutions to meet client-specific requirements, which include natural and forced convection, fluid phase change, liquid cooling, and thermal accessories.
Tokuyama Corporation, headquartered in Chiyoda-ku, Tokyo, and founded in 1918 is a manufacturer of Soda ash and methylene chloride. Soda ash is a fundamental raw material, with applications spanning the glass and detergent industries. Beyond this, it produces quality baking soda for food additives and calcium chloride. The diverse product portfolio includes multiple sections including chemicals, cement, electronic materials, environmental business, and life science. The products catalog includes silicon, microporous films, ion exchange membranes, Chlor, and alkali among others.
Ricoh Company, Ltd., established in 1936 and headquartered in Tokyo, Japan, is a manufacturer of office equipment and solutions. The company's core specialization lies in office imaging equipment, production print solutions, document management systems, and IT services. Its diverse product range includes printers, copiers, projectors, interactive whiteboards, and digital cameras. The company provides its comprehensive array of products and services in nearly 200 countries, serving the needs of businesses and professionals worldwide.
RISHO KOGYO CO. LTD. is a Japanese manufacturer of electronic materials and cast resin products founded in 1921 and based in Kita-ku, Osaka. The company produces various electronic materials, insulating materials, and epoxy cast resin devices. Its products include epoxy tape for smart card terminals, cast resin phase advanced capacitors, and thermosetting resin laminated tubes/rods. The company primarily serves clients in the energy distribution, civil engineering, and offshore sectors. It offers additional services such as R&D, environmental management, and customer support.
Industrial Summit Technology Corp, founded in June 1983, is a manufacturer of various polymer materials using polyimide resin based in Ichiriyama, Otsu, Shiga, Japan. The company produces various products such as polyimide varnish, RTM injection molding resin, polyimide foam, polyimide composite, and polyimide binder. These products are used in various applied products such as rechargeable batteries, airplane structures, circuit boards, radar absorbers, and smart glasses. The company also has their own research and development division for creating products based on the customers' requests or industry needs.
Mitsubishi Engineering-Plastics Corporation, established in 1994 and based in Minato Ward, Tokyo, Japan, is a manufacturer of plastics. The company specializes in polycarbonate resins, marketed as Iupilon and NOVAREX. These resins are known for impact resistance, thermal range, and molding precision. The applications span across automotive, medical, and electronics industries. The company's materials are integral to door handles, light guides, and office equipment. Its customer support extends from the initial product planning phase to full-scale mass production.
UNITIKA LTD., founded in 1889 and headquartered in Osaka, Japan, is a manufacturer specializing in polymers, advanced materials, fibers, and textiles. The company operates several divisions, including those specialized on nylon and polyester films, engineering plastics, spunbond and spunlace fabrics, as well as activated carbon fibers, and glass fibers. It serves various industries, providing materials for a range of applications, from automotive and civil engineering to medical and daily use products.
Shin-Etsu Chemical Co., Ltd., founded in 1926 in Japan, is a manufacturer and distributor of synthetic chemicals and electronic materials, such as semiconductor silicon and rare earth quartz. The company offers a wide range of products, including silicone sealants and rubbers, as well as cellulose derivatives used in foods and pharmaceuticals, and rare earth magnets. The company has four core business segments, including infrastructure chemicals, electronics materials, silicone-based functional agents, and specialized engineering for the development of plant design, construction, and maintenance.
Ranking as of September 2026
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | Shin-Etsu Chemical Co., Ltd. |
20.0%
|
| 2 | Wakefield Thermal, Inc. |
16.7%
|
| 3 | Tokuyama Corporation |
13.3%
|
| 4 | Industrial Summit Technology Corp |
10.0%
|
| 5 | Pharmacy Automation Supplies |
6.7%
|
| 6 | Ricoh Company Ltd. |
6.7%
|
| 7 | Mitsubishi Engineering-Plastics Corporation |
6.7%
|
| 8 | Resonac Holdings Corporation. |
6.7%
|
| 9 | UNITIKA LTD. |
6.7%
|
| 10 | U-MAP Inc. |
3.3%
|
Derivation Method
The ranking is calculated based on the click share within the thermal resin page as of September 2026. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
Newly Established Company
Company with a History
*Including some distributors, etc.
*Including some distributors, etc.
| Country | Number of Companies | Share (%) |
|---|---|---|
|
Japan
|
7 | 58.3% |
|
United States of America
|
2 | 16.7% |
|
Italy
|
1 | 8.3% |
|
United Kingdom
|
1 | 8.3% |
|
Netherlands
|
1 | 8.3% |
225 products found - Page 2
225 products - Page 2
KITAGAWA INDUSTRIES CO., LTD.
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■Features ・Higher magnetic permeability (μ’=13) and softer (ASKER C 40) than existing sheets. ・It has excellent adhesion and can simultaneously c...
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Takeuchi Industries Co., Ltd.
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■Features ・Highly effective with excellent thermal conductivity. - Made of flexible material that firmly adheres to the heat source. - Maintains s...
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KITAGAWA INDUSTRIES CO., LTD.
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■Features - A thermally conductive sheet that has two functions: heat conduction and vibration damping. ・Excellent vibration damping properties (l...
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Widework Co., Ltd.
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It is used by sandwiching it between a heating element (CPU, GPU, LED, etc.) and a heat sink (CPU cooler heat sink, etc.). ■Highly filled with car...
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Würth Elektronik
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■Features ・Size and shape can be customized ・No minimum order quantity or tool costs required ・No additional mechanical fixing of cooling assemb...
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■Features ・Highly effective with excellent thermal conductivity. - Made of flexible material that firmly adheres to the heat source. - Maintains s...
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Widework Co., Ltd.
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■ Characteristics ・ Various fever -generated parts ・ Use between between VRM, etc. (heat sink, etc.). ・ It is a very soft material to fill the g...
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Satsuma Soken Co., Ltd.
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■Features ・Exhibits high peel strength. ・Suitable for bonding dissimilar materials. ・Thanks to its flexibility, it offers high reliability again...
KITAGAWA INDUSTRIES CO., LTD.
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■Features ・Compared to normal thermal conductive sheets, it has the effect of lowering the noise level in the low frequency band. ・If the noise l...
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■ Characteristics ・ Used between heating (CPU, etc.) and heat dissipation (CPU cooler, heat sink, etc.). ・ The gaps of fine unevenness can be fil...
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Widework Co., Ltd.
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■ Characteristics ・ Used between the heating body (CPU, etc.) and the heat dissipation (CPU cooler, etc.). ・ Thermal conductivity 12W/m ・ K (AST...
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Taica Corporation
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KITAGAWA INDUSTRIES CO., LTD.
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■Features ・A thermally conductive sheet that is soft and has excellent adhesion to ASKER C 8, so it can reduce contact thermal resistance. ・Excel...
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■Features ・Size and shape can be customized ・No minimum order quantity or tool costs required ・Electrical insulation ・Puncture and shear resist...
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■Features ・Highly effective with excellent thermal conductivity. - Made of flexible material that firmly adheres to the heat source. - Maintains s...
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Widework Co., Ltd.
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■ Specifications ·Conductivity ・ Used temperature range Long-term temperature: -55 ° C to 125 ° C, short-term (moment) temperature: MAX260 ° C ・ ...
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Taica Corporation
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It is a sheet -type heat dissipation material that puts it in a gap between the heating body and the heat sink, such as a heat sink, and removes th...
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KITAGAWA INDUSTRIES CO., LTD.
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■Features ・A thermally conductive sheet that is soft and has excellent adhesion to ASKER C 8, so it can reduce contact thermal resistance. ・Excel...
Widework Co., Ltd.
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■Summary Ultra-soft thermal conductive sheet with excellent heat conduction ■Features ・Use it between the M.2 SSD and the heat sink. It fills the...
E-SONG EMC CO., LTD.
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■Summary ・The heat dissipation silicone pad is a heat conductive component that effectively transfers heat generated from heat sources inside vari...
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■Features - TIM that does not drip even when applied thickly. ・Effective for filling the gap between the heat spreader and ICs of different height...
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■ Overview ・ Graphene is a substance whose carbon (= carbon) atom is tied to a hexagon like a bee nest. It is said that when pulled, the strongest...
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Widework Co., Ltd.
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■ Specifications ·Conductivity ・ Used temperature range Long-term temperature: -55 ° C to 125 ° C, short-term (moment) temperature: MAX260 ° C ・ ...
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■ Characteristics ・ Use between the CPU and the heat sink. ・ The gaps of fine unevenness can be filled and the heat can be conveyed efficiently t...
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KITAGAWA INDUSTRIES CO., LTD.
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■Features ・A thermally conductive sheet that can provide optimal thicknesses from 1.0mm to 4.0mm and minimizes the load on the board. ・Since it i...
Taica Corporation
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It is a sheet -type heat dissipation material that puts it in a gap between the heating body and the heat sink, such as a heat sink, and removes th...
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