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  3. Thermal Resins
  4. High Thermal Conductivity Adhesive, High Thermal Conductivity Epoxy Resin (Satsuma Soken Co., Ltd.)
High Thermal Conductivity Adhesive, High Thermal Conductivity Epoxy Resin-SST-80XX
High Thermal Conductivity Adhesive, High Thermal Conductivity Epoxy Resin-Satsuma Soken Co., Ltd.

High Thermal Conductivity Adhesive, High Thermal Conductivity Epoxy Resin
Satsuma Soken Co., Ltd.

About This Product

■Features

・Exhibits high peel strength. ・Suitable for bonding dissimilar materials. ・Thanks to its flexibility, it offers high reliability against thermal stress. ・A flexible, tough adhesive that resists peeling. ・On request, the hardness, electrical conductivity, and thermal conductivity can be adjusted (the values below are standard values) . ・After the two parts are mixed, gelation takes about 8 hours at room temperature.

  • Product

    High Thermal Conductivity Adhesive, High Thermal Conductivity Epoxy Resin

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1 Models of High Thermal Conductivity Adhesive, High Thermal Conductivity Epoxy Resin

Image Part Number Price (excluding tax) Storage Life Storage Conditions Shipping Form Curing Conditions Formulation (by Weight)
High Thermal Conductivity Adhesive, High Thermal Conductivity Epoxy Resin-Part Number-SST-80XX

SST-80XX

Available upon quote

Six months before mixing

Sealed, in a cool dark place

Two-part, B-stage

Room temperature: 2 days
80°C: 1 hour

Custom specification

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About Company Handling This Product

Satsuma Soken Co., Ltd.

  • Japan

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