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High Thermal Conductivity Adhesive, Thermally Conductive Silicone Resin Adhesive-SST2-RSMZ
High Thermal Conductivity Adhesive, Thermally Conductive Silicone Resin Adhesive-Satsuma Soken Co., Ltd.

High Thermal Conductivity Adhesive, Thermally Conductive Silicone Resin Adhesive
Satsuma Soken Co., Ltd.


About This Product

■Features

・Exhibits high flexural strength. ・Suitable for bonding dissimilar materials. ・Thanks to its flexibility, it offers high reliability against thermal stress. ・A flexible, tough adhesive that resists peeling. ・On request, the hardness, electrical conductivity, and thermal conductivity can be adjusted. (The values below are standard values.) ・After the two parts are mixed, gelation takes about 12 hours at room temperature. ・If frozen storage is possible, it can be supplied as a one-part product. In that case, the pot life is one month.

  • Product

    High Thermal Conductivity Adhesive, Thermally Conductive Silicone Resin Adhesive

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1 Models of High Thermal Conductivity Adhesive, Thermally Conductive Silicone Resin Adhesive

Image Part Number Price (excluding tax) T-Peel (Aluminum) T-Peel (Copper) Shear Strength (Aluminum) Glass Transition Temperature Storage Life Storage Conditions Shipping Form Color Tensile Strength Thermal Conductivity Elongation at Break Curing Conditions at 100°C Curing Conditions at Room Temperature Hardness Coefficient of Linear Expansion Surface Resistivity Formulation (by Weight)
High Thermal Conductivity Adhesive, Thermally Conductive Silicone Resin Adhesive-Part Number-SST2-RSMZ

SST2-RSMZ

Available upon quote

2.7 kN/m

2.1 kN/m

3.2 N/mm2

-40°C

Six months before mixing

Sealed, in a cool dark place

Two-part

Gray

4.1 N/mm2

2.8 W/m.K

125%

1 hour

2 days

80 Shore A

53 ppm/K

>10 MΩ

Base resin : hardener = 1:1

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