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High Thermal Conductivity Adhesive, Thermally Conductive Silicone Resin AdhesiveHandling Company
Satsuma Soken Co., Ltd.Categories
| Image | Part Number | Price (excluding tax) | T-Peel (Aluminum) | T-Peel (Copper) | Shear Strength (Aluminum) | Glass Transition Temperature | Storage Life | Storage Conditions | Shipping Form | Color | Tensile Strength | Thermal Conductivity | Elongation at Break | Curing Conditions at 100°C | Curing Conditions at Room Temperature | Hardness | Coefficient of Linear Expansion | Surface Resistivity | Formulation (by Weight) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SST2-RSMZ |
Available upon quote |
2.7 kN/m |
2.1 kN/m |
3.2 N/mm2 |
-40°C |
Six months before mixing |
Sealed, in a cool dark place |
Two-part |
Gray |
4.1 N/mm2 |
2.8 W/m.K |
125% |
1 hour |
2 days |
80 Shore A |
53 ppm/K |
>10 MΩ |
Base resin : hardener = 1:1 |
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Reviews shown here are reviews of companies.