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Atomic layer deposition equipment ALD series
Sanko Ematech Co., Ltd.

Sanko Ematech Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

30.9hours

Relatively Fast Response


About This Product

ALD (Atomic Layer Deposition) is an atomic layer deposition method that forms a single atomic layer in one cycle, and a thin film is formed by repeating the cycle. Uniform layer control at the atomic layer level is possible, making it possible to form thin films with high quality and excellent step coverage. Ideal for forming films on substrates with complex shapes. A thin film with excellent gas barrier properties can be obtained.

■Compatible film types

SiO2 TiO2 Al2O3

■Summary

・Batch processing of 25 φ4 inch boards ・Substrate rotation mechanism ・Substrate heating: 25-120℃

■Features

・Excellent film thickness controllability as the film is formed one atomic layer at a time. ・It is possible to form a film with good coverage even on high aspect ratio substrates. ・It is possible to form a film while keeping the substrate temperature low. ・Excellent distribution within the substrate plane.

■Main uses

・LED (chromaticity adjustment, Ag sulfuration prevention film) ・Electronic devices (insulating film, barrier metal) ・Gas barrier film, water vapor barrier film ・Film deposition on substrates with complex shapes

  • Product

    Atomic layer deposition equipment ALD series

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About Company Handling This Product

Response Rate

100.0%


Response Time

30.9hrs


Company Review

5.0
  • Japan

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