High flexibility in precursor, process gas, and hardware configuration FlexAL ALD atomic layer deposition system
Oxford Instruments Ltd.
About This Product
FlexAL ALD (Atomic Layer Deposition) systems offer a wide range of optimized, high-quality plasma and thermal ALD processes with high flexibility in precursor, process gas, and hardware configurations using a single process chamber.
■Features
・Thermal ALD and low-damage plasma ALD using remote plasma can be used together in one deposition chamber.
・RF electrode options to control thin film properties
・High throughput achieved through cassette handling, which is ideal for the manufacturing process.
・High flexibility in selecting precursors, process gases, hardware, and options
・Optimized to maintain high quality substrate with low damage
・Easy chamber maintenance thanks to replaceable liner
・Low-temperature deposition that achieves high-quality thin films even on surfaces that are significantly affected by temperature changes
■Function
Chamber ports and windows for integrating in-situ analytical equipment such as ellipsometry
・Automatic single-wafer type load lock that can load boards up to 200mm
・Can be clustered by adding process modules that perform vacuum transfer between chambers
・Precursor replacement procedures are displayed on the monitor with a checklist
・Clean room interface available with through-the-wall structure
・Can incorporate an ozone generator
・Wide range of electrode options - ground electrode and bias electrode
・Turbo molecular pump effective for nitrides and metals that are sensitive to moisture
・RF table bias options to improve film properties such as conductivity, crystallinity, and stress control
-
Product
High flexibility in precursor, process gas, and hardware configuration FlexAL ALD atomic layer deposition system
-
Handling Company
Oxford Instruments Ltd.
-
Categories
1 Models of High flexibility in precursor, process gas, and hardware configuration FlexAL ALD atomic layer deposition system
| Product Image | Part Number | Price (excluding tax) | Clusterable module | Plasma source generator | Precursor | Temperature range | Wafer size |
|---|---|---|---|---|---|---|---|
|
|
FlexAL ALD |
Available upon quote | PECVD, ICPCVD, RIE, sputtering module | 300W or 600W |
Precursor options for research (up to 100g) and manufacturing (up to 500g) Up to 8 metallic liquid or solid rapid bubbling precursors can be used Up to 10 plasma and thermal gas precursors |
30~550 ℃ (using table bias) | Maximum 200mm |
Customers who viewed this product also viewed
Other products of Oxford Instruments Ltd.
View more products of Oxford Instruments Ltd.
About Company Handling This Product
- Japan