High -precision chasing wheel for silicon wafers reduction of swing when installing equipment-High -precision surfacing wheel

High -precision chasing wheel for silicon wafers reduction of swing when installing equipment
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

TOKYO DIAMOND TOOLS MFG.CO.,LTD.'s Response Status

Response Rate

100.0%

Response Time

22.3hours

Relatively Fast Response

About This Product

A high -precision surface for silicon wafer that improves wavy processing accuracy and wheel life with higher accuracy of wheels. The groove accuracy of the metal bond diamond wheel with a groove for surface and the geometric tolerance of the groove bottom has been greatly improved from the conventional product.

In recent years, the need to stabilize the surface width and surface shape in order to improve the tip yield near the outer periphery due to the control of the outer edge edge of the silicon wafer due to the high -scale linear of semiconductors is increasing. Our high -precision surface for silicon wafers is a wheel that improves the accuracy of the surface wheels and the bottom of the groove to meet these needs. By improving the geometric tolerance of the groove bottom, the swing when mounting the surface to the device is installed is improved. By improving swing, the wheel grooves are uniformly contacted on the outer periphery of the wafer during processing, and the uneven wear is suppressed and contributed to the improvement of wheels.

■ Features・ Silicon wafer -removing wheels that have improved gap shape accuracy and improved geometric tolerance at the bottom of the groove
・ The surface width and shape of the wafer around the wafer are stabilized by high accuracy and reduced swing
・ Waha's edge area shape around the outermost circumference can be controlled to improving chip yield
・ The high -precision of the wheel can reduce the swing at the time of installing the device, which can significantly improve the wheel life.

■ Appropriate example・ Φ300mm (12 inch) Silicon wafer outer peripheral surface ・ Bebe ring
・ R type (round full round) groove shape

Model
There is 1 model available for this product.

Product
High -precision chasing wheel for silicon wafers reduction of swing when installing equipment

Handling Company
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

210+ people viewing

Last viewed: 13 hours ago

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1 Models of High -precision chasing wheel for silicon wafers reduction of swing when installing equipment

Image	Part Number	Price (excluding tax)
	High -precision surfacing wheel	Available upon quote

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About Company Handling This Product

TOKYO DIAMOND TOOLS MFG.CO.,LTD.

Response Rate

100.0%

Response Time

22.3hrs

Company Overview

Tokyo Diamond Tools Mfg. Co., Ltd. is a diamond tools manufacturer established in 1932 and based in Tokyo, Jap...

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High -precision chasing wheel for silicon wafers reduction of swing when installing equipment TOKYO DIAMOND TOOLS MFG.CO.,LTD.

TOKYO DIAMOND TOOLS MFG.CO.,LTD.'s Response Status

About This Product

■ Features

■ Appropriate example

1 Models of High -precision chasing wheel for silicon wafers reduction of swing when installing equipment

High -precision surfacing wheel

Other products of TOKYO DIAMOND TOOLS MFG.CO.,LTD.

About Company Handling This Product

High -precision chasing wheel for silicon wafers reduction of swing when installing equipment
TOKYO DIAMOND TOOLS MFG.CO.,LTD.