Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel
TOKYO DIAMOND TOOLS MFG.CO.,LTD.
About This Product
■ Realization of high -quality processing surface by flat grinding such as SIC substrates for compound semiconductor
・ Realizes a high -quality grinding surface by combining a ultra -fine diamond and a vitrafide bond with a combination tissue of large -diameter pores and micro -holes.
・ By adopting a bond that realizes ultra -fine crushing, the self -produced blade in the minimum unit is realized, and the sharpness continues.
・ Stable high -quality surface is obtained, and processing costs are reduced
■ Long life of wheels in [rough processing] of SIC wafer plane grinding
Our vigorous hole Vitribondo wheel "Vega" is a new bond wheel developed by its own whetstone tissue control technology. In particular, the processing and wheel life is balanced by the cracked chopping of SIC Waha's flat grinding. The 6 -inch SIC Waha is also non -dress and can be processed. Excellent wear resistance increases the number of wafes that can be processed per wheel, contributing to reducing the processing cost of wafers.
■ Features
・ Significantly improves life expectancy from conventional products (wheel wear rate of 15%or less)
・ Achieved stable processing at 0.6 μm/sec
・ Lineup of two types, which emphasizes grinding and life span
・ Achievements in the Balkwake Haha crafting process (SI side), the wafer back grind (C side) in the device process
・ After grinding, surface roughness RA17NM-20nm
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Product
Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel
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Handling Company
TOKYO DIAMOND TOOLS MFG.CO.,LTD.
1 Models of Compound semiconductor wafer plane grinding "Vega" Vitri Fide Bond Wheel
| Product Image | Part Number | Price (excluding tax) |
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Vega |
Available upon quote |
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