Diamond notch wheel for surfacing sections of semiconductors
TOKYO DIAMOND TOOLS MFG.CO.,LTD.
About This Product
■ Features
It is a wheel for chamfering the notch part of the semiconductor wafer. The unique processing technology has good swing accuracy of the diamond layer against the shank. In addition to Silicon Wahaha, we also provide wheels of various specifications for compound semiconductor wafers such as SIC (silicon carbite) and LT (lithium tantalate) and quartz wafers. In addition to general R -shaped (round full round) and T -type grooves, we will also support special shapes such as left and right asymmetric shapes.
■ Applicable materials for diamond notch wheels
Silicon, SIC (silicon carbide carbide / silicon carbite), LT (lithium / lithium tantalate), LN (lithium nioobic acid), Ishido, sapphire
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Product
Diamond notch wheel for surfacing sections of semiconductors
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Handling Company
TOKYO DIAMOND TOOLS MFG.CO.,LTD.
1 Models of Diamond notch wheel for surfacing sections of semiconductors
| Product Image | Part Number | Price (excluding tax) | Axial diameter | Bond type | Groo angle intersection | Groove number | Outer diameter | Particle size specifications | Swing accuracy | full length |
|---|---|---|---|---|---|---|---|---|---|---|
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Diamond notch wheel |
Available upon quote | H5 tolerance | Metal bond | ≧ 0.5 degrees (one corner) | ~ 5 ditch | ~ 4D (minimum portion 2D) | #400 ~#3,000 | ≦ 5 um@min. | ~ 35L |
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