Excellent cutting semiconductor wafer surface diamond wheel-Diamond wheel for semiconductor wafers

Excellent cutting semiconductor wafer surface diamond wheel
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

About This Product

■ Features
・ Silicon wafer -filled wheels provide “ME” bonds with excellent sharpness and high groove -shaped maintenance. The finishing surface is also good, reducing the amount of polish after chamfering, reducing the total processing cost by reducing the time of the postage and the reduction of consumables.
・ SIC -Sapphire Waha Heavy wheels offer a bond specification wheels with excellent sharpness and excellent grinding. For small amounts and medium -quantum production, we can also provide an electroded bond surface wheel.
・ LT / LN Waha's surface wheels provide bond specifications that suppress the occurrence of wafing of wafers with brittle.
・ In addition to general R -shaped (round full round) and T -type grooves, we will also support special shapes such as left and right asymmetric shapes.

■ Applicable material for diamond surface wheels
Silicon, SIC (silicon carbide / silicon carbide), sapphire, LT (lithium / lithium tantalate), LN (lithium niovate), GAN (gallium nitride / gallium night ride), GAAS (galium arsenic), Ishigami.

* 1 Roughly finished -integrated wheels can be made
* 2 Please contact us for other sizes
* 3 Please contact us for other tolerance
* 4 Depending on the groove shape, it is possible as much as 10 grooves.

Model
There are 1 models for this product.

Product
Excellent cutting semiconductor wafer surface diamond wheel

Handling Company
TOKYO DIAMOND TOOLS MFG.CO.,LTD.

*Please note that we may not be able to accommodate sample requests.

1 Models of Excellent cutting semiconductor wafer surface diamond wheel

Product Image	Part Number	Price (excluding tax)	Bond type	Dynamic balance	Granularity * 1	Groove angle tolerance	Inner diameter * 3	Number of gaps * 4	Outside diameter * 2
	Diamond wheel for semiconductor wafers	Available upon quote	Metal bond	≧ 0.1g @min.	#400 ~#3,000	Course difference ≧ 0.5 degrees (one corner)	H6 tolerance	~ 10	φ102, φ202