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  4. Powder treatment Small rotation type vacuum plasma device MUG-80 (SAKIGAKE-Semiconductor)
Powder treatment Small rotation type vacuum plasma device MUG-80-MUG-80
Powder treatment Small rotation type vacuum plasma device MUG-80-SAKIGAKE-Semiconductor

Powder treatment Small rotation type vacuum plasma device MUG-80
SAKIGAKE-Semiconductor

SAKIGAKE-Semiconductor's Response Status

Response Rate

100.0%

Response Time

120.0hours

About This Product

■ Product overview

･ Introduced a rotating stirring mechanism in the vacuum chamber ･ Dry type and full -length processing ･ Stir during glow discharge to ensure high uniformity ･ Because of the rotation type, there is no need to reit the small parts such as chip. ･ Etching of powder and small parts, thin film formation, water repelliation, oxidation reduction

  • Product

    Powder treatment Small rotation type vacuum plasma device MUG-80

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1 Models of Powder treatment Small rotation type vacuum plasma device MUG-80

Image Part Number Price (excluding tax) External dimensions weight Rotation part Gas system Gas control method Pressure adjustment power supply
Powder treatment Small rotation type vacuum plasma device MUG-80-Part Number-MUG-80

MUG-80

Available upon quote

400mm (W) x 353mm (d) x 340mm (H)

30kg

φ80 × 42mm (D)

option

option

option

100V, 15A (50Hz/60Hz)

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About Company Handling This Product

SAKIGAKE-Semiconductor

Response Rate

100.0%

Response Time

120.0hrs

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