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Sputter device for FE-SEM tungsten coat MSP-20-TK-MSP-20-TK
Sputter device for FE-SEM tungsten coat MSP-20-TK-Vacuum device

Sputter device for FE-SEM tungsten coat MSP-20-TK
Vacuum device

Vacuum device's Response Status

Response Rate

100.0%

Response Time

40.2hours


About This Product

Magnetron Patta device is applied to promote ionization on the cathode surface layer using a powerful magnet on the back of the target, and apply a metal molecule to collide with a magnetic field by a magnetic field. Precious metals such as gold and platinum are used mainly for electron microscopes. In addition, we have a lineup of top models that can spat other metal targets.

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    Sputter device for FE-SEM tungsten coat MSP-20-TK

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1 Models of Sputter device for FE-SEM tungsten coat MSP-20-TK

Image Part Number Price (excluding tax) target Target metal Advanced voltage/current Sample stage Target -sample interval Sample size Chamber size shutter timer Exhaust system Achievement vacuum Introduction of atmosphere gas Safety measure Device size power supply
Sputter device for FE-SEM tungsten coat MSP-20-TK-Part Number-MSP-20-TK

MSP-20-TK

Available upon quote

φ50 m M air -cooled magnetron

Standard: W, Options: MO/CR/Ni/Ta/Cu/Ti/(thickness 1mm) Precious metal: au/au-pd/PT/PT-PD/AG (thickness 0.5mm)

Voltage DC0 ~ 500V/current DC0-200mA

φ47mm floating system

50-70mm

Diameter ≦ φ45mm, height: 30 m m

Inner diameter 149mm, depth 126mm

A shutter standard attached for press padta

OMRON's electronic timer

External RP50ℓ/min14.6kg

1 (PA) or less

1/4 'introduced pipe, 0.07MPa or less.

Fuses by system, upper lid open sensor

Body W354mm x D368mm x H43022kg

AC100V, 15A with ground wire 3m used 3m

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About Company Handling This Product

Response Rate

100.0%


Response Time

40.2hrs

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