21 Microelectronic & Semiconductor Package Manufacturers in 2024
This section provides an overview for microelectronics & semiconductor packages as well as their applications and principles. Also, please take a look at the list of 21 microelectronic & semiconductor package manufacturers and their company rankings. Here are the top-ranked microelectronic & semiconductor package companies as of November, 2024: 1.ISI - Interconnect Systems, 2.Mercury, 3.Amkor Technology.
Table of Contents
What Is an IC Package?
An IC package is a case component attached to semiconductor chips. It serves multiple functions, including supplying power, protecting the chip from external environmental factors, transmitting signals to and from the chip, and enhancing chip performance.
Applications of IC Packages
These packages are integral to a wide range of devices, from smartphones and tablets to various sophisticated electronic devices in homes. As technology evolves, there is a growing demand for smaller, lighter, and more functional packages. They are also adapting to incorporate multiple mechanisms in a single package, especially in sensor devices that operate on multiple wavelengths.
Principle of IC Package
IC packages consist of structures for electrical connection and protection. Electrical connections often use gold plating for high-specification applications. The protective part, known as the sealing material, has traditionally used metal but is now increasingly using resin-based materials for weight and cost efficiency. Ceramics are also gaining popularity due to their superior properties.
Types of IC Packages
Package types vary based on the terminal extension method and the material used for the package body. They range from plastic packages to ceramic packages and include:
1. System In Package (SIP)
Encapsulates multiple chips in one package, suitable for cost reduction and insertion mounting, with excellent heat dissipation performance.
2. Small Outline Package (SOP)
Features terminals extending in two directions, often used for small semiconductor chips.
3. Quad Flat Package (QFP)
Has terminals extending in four directions, suitable for various applications.
4. Land Grid Array (LGA)
Includes terminals at the package bottom, allowing for grid-pattern socket mounting.
Other Information on IC Packages
Advantages of Ceramics
Ceramics offer high thermal resistance and maintain shape after heat treatment. They are in high demand due to their thermal conductivity and workability, leading to advancements in recycling technology for sustainable material sourcing.
List of 21 Microelectronic & Semiconductor Package Manufacturers
*Including some distributors, etc.
Sort by Features
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- Company Size: largest first
- Year Founded: oldest first
- Year Founded: earliest first
Sort by Area
- United States of America
- Hong Kong
- Japan
- Malaysia
- Singapore
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Mercury
System-in-Package
Manufacturer Overview
Mercury Systems is a manufacturer of advanced solutions for a wide range of applications, including aerospace and defense, cybersecurity, radar and electronic warfare. Established in 1981, the company is headquartered in Andover, Massachusetts, and has operations across the United States and internationally. Their products include secure processing systems, embedded computing and processing solutions, memory, storage devices, radio frequency and microwave components. One of their achievements is their inclusion in the Fortune 1000 list of America's largest companies. In 2020, they were also named one of the World's Most Ethical Companies by the Ethisphere Institute for the fourth year in a row.
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Amkor Technology
IC packaging
Manufacturer Overview
Amkor Technology, founded in Tempe, Arizona, in 1968 is a supplier of semiconductor packaging and test services. The company's product portfolio includes Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, and Power Discrete. Their products are used in markets such as Automotive and Transportation, Telecommunications, Industrial Automation, Healthcare and Medical Devices and Aerospace and Defense. The company has product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.
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ISI - Interconnect Systems
Microelectronic Packaging
Manufacturer Overview
ISI - Interconnect Systems, founded in 1987 and located in Camarillo, California, USA is a manufacturer of interconnect and packaging products. The company specializes in designing and manufacturing packaging solutions including microelectronics assembly, wire bonding, encapsulation as well as the production of interconnect components like Standard Connectors, Pogo Pins, Hilo, and FlexFrame interconnects. The products are largely used in diverse sectors including aerospace, military, telecom, networking, and communication. The latest acquisition of Nallatech & Bittware has led to the production of Intel and Xilinx FPGA technology-enabled accelerator products.
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SCHOTT North America, Inc
microelectronic packages
Manufacturer Overview
SCHOTT North America, Inc., founded in 1884 and located in Rye Brook, New York, is a manufacturer of specialty glass and glass-ceramics. They offer a diverse range of products that include ambient light, borofloat, glass door systems, pharmaceutical type I glass tubing, and nextrema. SCHOTT's specialty glass and glass-ceramics offer unique properties such as high heat resistance, chemical durability, optical clarity, and thermal shock resistance, making them crucial components in technological and manufacturing processes. Their products have diverse applications across industries, including lighting and illumination, laboratory and pharmaceutical settings, home appliances, industrial and process equipment, electronics, and optics.
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QP Technologies
IC packaging
Distributor Overview
QP Technologies is a supplier of microelectronic packaging established in 1992 and based in Escondido, California. Its product portfolio includes open-molded plastic packages, open-cavity plastic packages, IC packages, and laminate substrates. Its products cater to several sectors, such as automotive, commercial, compound semiconductors, industrial, and medical. The company is part of the Promex Industries. Its manufacturing plant is ITAR registered and has obtained several ISO certifications, such as ISO 9001:2015 and ISO-13485:2016 certifications.
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Materion
Microelectronic Packages
Distributor Overview
Materion is a supplier of engineered materials established in 1931 and based in Mayfield Heights, Ohio. It specializes in manufacturing alloys, beryllium products, composite and clad metals, inorganic chemicals, and microelectronics packaging materials. Its manufactured products are utilized in the telecommunications, consumer electronics, automotive, medical, and optical coating industries. Its product market covers regions such as the UK, Germany, Korea, and China. The company acquired several certifications, namely ISO 13485, ISO 14001, ISO 9001, and ISO/IEC 17025 certifications.
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Johnson Electric
Microelectronics
Manufacturer Overview
Johnson Electric, since 1959, is a manufacturer of motors, micro-switches, solenoids, microelectronics, and flexible printed circuits based in Shatin, Hong Kong. Their products include AC motors, automotive switches & subsystems, cargo bikes, EMI-shielded flexible circuits, snap action switches, used in automotive, building automation, digital security, food & beverage, and laboratory equipment. Johnson Electric has been in the Hang Seng Corporate Sustainability Benchmark index since 2018. The Hong Council of Social Service awarded it the 5+ caring company award in 2022-2023 and additionally, it is an Institute of Business Ethics supporter.
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NGK SPARK PLUG CO.,LTD.
Semiconductor Packages and Substrates
Manufacturer Overview
NGK Spark Plugs Co. Ltd, established in 1936 at Nagoya, Japan is a manufacturer of spark plugs for internal combustion and other varieties of engines used in automobiles. The company has a global clientele and manufactures new age spark plugs for automobiles that come with better ignition and reliability. The products included but not limited to are spark igniter plugs, glow plugs, glow controller and resistor cables. These spark plugs are temperature-resistant, safe, environmentally sustainable and reduce fuel consumption with their better ignition properties. They also manufacture sensors and ceramics for multiple applications such as automobiles, semiconductors and medical equipment.
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SHINKO ELECTRIC INDUSTRIES CO., LTD.
Semiconductor Package
Manufacturer Overview
SHINKO ELECTRIC INDUSTRIES CO., LTD., established in 1946 and headquartered in Nagano, Japan, is a manufacturer of semiconductor packages used in everyday electronic products. The company produces semiconductor packages adapted for the miniaturization, acceleration, and performance enhancement of semiconductors. It provides cutting-edge packaging technologies for electronic products that incorporate advanced semiconductors, IoT and AI as well as auto markets such as autonomous driving and electrical vehicles. Most of its products are customized based on the close collaboration with customers. The company has acquired various environmental and quality management system certifications from ISO, IATF and JIS.
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Unisem
IC package
Manufacturer Overview
Unisem, established in 1989, is based in Kuala Lumpur, Malaysia, as a manufacturer and supplier of semiconductor assembly. The company manufactures a range of products, including wafer bumping, wafer probing, wafer grinding, leadframe, substrate IC packaging, and wafer level CSP. These products are compliant with China RoHS and EU Directive 2011/65/EU, and they undergo annual ICP testing verification. These manufactured items find applications within the electronics industry and are distributed across various regions, including Malaysia, Indonesia, and China. The company achieved several certifications, like ISO 45001:2018, IATF 16949:2016, and Samsung ECO Green Partner Certification in 2014.
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Fujitsu Components America, Inc.
IC packaging
Manufacturer Overview
Fujitsu Components America, Inc. is a global leader in electronics manufacturing services (EMS), providing integrated services and solutions for OEMs and ODMs operating in the automotive, communications, computing, consumer, industrial and medical sectors. Fujitsu Components America’s Products include relays, touch panels, and wireless modules, and input and pointing devices. Fujitsu Component America serves customers across volume spectrums in variable-mix, variable-volume production.
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Kyocera International
Semiconductor packaging
Manufacturer Overview
Kyocera International is a manufacturer of semiconductor ceramic parts established in 1969 and based in California, United States. It manufactures semiconductor packaging, automotive components, kitchen tools, industrial ceramics, and liquid crystal displays. It caters to the communications, automotive, environment, medical, and healthcare industries. Its product market covers several regions, like Africa, America, Asia, Europe, and Oceania. The company acquired several certifications, such as ISO/IEC 15408, ISO 9001, ISO 14001, and ISO 27001 certifications.
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ROHM MECHATECH
Semiconductor Package Dies
Manufacturer Overview
ROHM Mechatech Co. Ltd., established in 1988 and based in Kyoto, Japan, is a manufacturer of key components for semiconductor production within the ROHM Group's vast network. The company specializes in producing tooling, semiconductor package dies, lead frames and essential components for semiconductor fabrication. Its advanced technology helps create a wide variety of electronic devices, from smartphones to sophisticated car systems. With facilities in the Philippines and Thailand, the company supplies a diverse clientele with premium products.
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TOPPAN INC.
semiconductor package substrate
Manufacturer Overview
TOPPAN INC., a company founded in 1900 and headquartered in Tokyo, Japan, is a manufacturer and supplier specializing in electronic components and materials. The company’s product portfolio includes color filters, functional films, photomasks, TFT-LCDs, and semiconductor package substrates. These products are utilized by various industries, including electronics manufacturing, display technology, semiconductor manufacturing, consumer electronics, and education and research. The company provides customer services including metal etching services, consultation and turnkey solutions, and customer collaboration. The company has offices in various countries, including China, France, Germany, the USA, and Singapore, for global reach.
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Saint-Gobain in Japan
Semiconductor Capsulation
Manufacturer Overview
Saint-Gobain in Japan, established in 1917 and headquartered in Tokyo, Japan, is a manufacturer and distributor of materials and solutions for construction, mobility, healthcare, and various other industrial applications. The company's product portfolio includes glass ceramics, abrasive products, performance plastics, glass wool, and automotive glass. These products are applied in various industries, including automotive, aeronautical, healthcare, defense, and the food and beverage industry. The company holds both ISO 9001 and ISO 14001 certificates, as well as an OHSAS 18001 certificate for quality and EHS (Environmental Health and Safety) systems.
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Honeywell
SEMICONDUCTOR PACKAGING
Manufacturer Overview
Honeywell, founded in 1906, in Wabash, Indiana is manufacturer of automotive parts, building technologies, and performance and safety materials for aerospace, The company's product portfolio includes electronic guidance systems, cockpit instrumentation, lighting, automotive parts, and primary propulsion and secondary power turbine engines. The company serves industries such as Oil and Gas, Aerospace and Defense, Automotive and Transportation, Construction, and Power Generation. Their headquartere is located in Carolina and they have global sales offices and distributions channels.
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Integra
IC Packaging
Manufacturer Overview
Integra, established in 1983 and based in Wichita, Kansas, is a manufacturer of semiconductor components. The company also assembles semiconductor components and does semiconductor testing and packaging components. The testing of semiconductors service is catered to medical, military, and communications industries. The mission-critical semiconductor components made by the company deliver failure-free performance and are used in Hi-Rel applications. The company also makes chips and tests before shipping; all its components are used in multiple space applications.
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XT Xing Technologies
Microelectronics Packages
Manufacturer Overview
XT Xing Technologies, established in 2000, is based in Hong Kong, China, and Singapore as a manufacturer of engineering materials. Its manufactured products are semiconductor wafer materials, such as silicon, germanium, epitaxial, and thin film deposition. It also manufactures PVD thin film coating materials like pure metals, carbides, oxides, nitrides, and multiple alloys. Its manufactured products cater to the hard disk, semiconductor, and electro-mechanical industries. The company is a member of the Singapore Industrial Automation Association and SEMI Organization. It obtained several ISO certifications, such as ISO 9001, ISO 14001, and ISO 45001 certifications.
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RoboTechnik Intelligent
Micro-Electronics
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Silicon Connection
Microelectronics Packaging
Distributor Overview
Silicon Connection, established in 2000, is based in Singapore as a distributor of semiconductor solutions. Its product includes chip trays, film frame shipper front opening unified pod, gel-film, membrane box, and wafer ring frame. Its manufactured products cater to microelectronics packaging, facilities components and equipment, and wafer materials sectors. Its manufactured products market covers the South East Asia region. Its products comply with the Code of Conduct set by the Responsible Business Alliance. The company is part of the SEMI Organization, SSIA, and the Singapore Business Federation. It also partners with several brands, such as Entegris, Gel-Pak, Schott, and Omron Sentech.
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Microelectronic & Semiconductor Package Manufacturer Ranking
*Including some distributors, etc.Ranking as of November 2024
Derivation Method| Rank | Company | Click Share |
|---|---|---|
| 1 | ISI - Interconnect Systems |
13.2%
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| 2 | Mercury |
8.7%
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| 3 | Amkor Technology |
8.1%
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| 4 | SCHOTT North America, Inc |
7.0%
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| 5 | QP Technologies |
6.4%
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| 6 | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
6.4%
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| 7 | Mini-Systems |
6.2%
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| 8 | Integra |
5.3%
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| 9 | Materion |
5.3%
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| 10 | Honeywell |
5.1%
|
Derivation Method
The ranking is calculated based on the click share within the microelectronic & semiconductor package page as of November 2024. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.Number of Employees
- SCHOTT North America, Inc: 17,300
- SHINKO ELECTRIC INDUSTRIES CO., LTD.: 4,850
- Saint-Gobain in Japan: 782
Newly Established Company
- Silicon Connection: 2000 (24 years ago)
- ISI - Interconnect Systems: 1987 (37 years ago)
- Mini-Systems: 1968 (56 years ago)
Company with a History
- SCHOTT North America, Inc: 1884 (140 years ago)
- NGK SPARK PLUG CO.,LTD.: 1936 (88 years ago)
- SHINKO ELECTRIC INDUSTRIES CO., LTD.: 1946 (78 years ago)
Microelectronic & Semiconductor Package Manufacturers in United States
*Including some distributors, etc.
- Mercury
- Amkor Technology
- ISI - Interconnect Systems
- SCHOTT North America, Inc
- Mini-Systems
- QP Technologies
- Materion
Global Distribution of Microelectronic & Semiconductor Package Manufacturers by Country
*Including some distributors, etc.
| Country | Number of Companies | Share (%) |
|---|---|---|
United States of America
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7 | 50.0% |
Japan
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4 | 28.6% |
Hong Kong
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1 | 7.1% |
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Malaysia
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1 | 7.1% |
Singapore
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1 | 7.1% |
