Yamaha Motor Corporation, USA
Toray Engineering Co., Ltd.
TDK Corporation.
Setna, LLC
SET Corporation SA
Semiconductor Equipment Corporation
Chip Hua Equipment & Tools Pte Ltd
Athlete FA Corporation

15 Flip Chip Bonder Manufacturers in 2024

This section provides an overview for flip chip bonders as well as their applications and principles. Also, please take a look at the list of 15 flip chip bonder manufacturers and their company rankings. Here are the top-ranked flip chip bonder companies as of February, 2024: 1.Yamaha Motor Corporation, USA, 2.Semiconductor Equipment Corporation, 3.SHIBUYA CORPORATION.

Table of Contents

List of 15 Flip Chip Bonder Manufacturers

*Including some distributors, etc.

Sort by Features

  • Default
  • Company Size: largest first
  • Year Founded: oldest first
  • Year Founded: earliest first

Sort by Area

  • United States of America
  • France
  • Germany
  • Japan
  • Republic of Korea
  • Singapore
    • Yamaha Motor Corporation, USA
      • United States of America Address: 3065 Chastain Meadows Parkway Marietta, Georgia, United States of America

      Manufacturer Overview

      Yamaha Motor Corporation, founded in 1955 with their Head Quarters in Iwata, Japan is a manufacturer of motorcycles, marine products, and other motorized products. Yamaha Motor Robotics, founded in 1955 is a subdivision of Yamaha Motor Corporation, and they produce machines that are used in the surface mounter industry. The company offers servo-motor control and image recognition technology for vision systems to develop solder-paste printers, printed circuit board inspection machines, flip-chip hybrid placers, and dispensers. They also provide SMD storage systems and software solutions, and they produce articulated robots, and cartesian robots that have applications in robotics.

    • Semiconductor Equipment Corporation
      • United States of America Address: 5154 Goldman Ave. Moorpark, California, United States of America

      Company Overview

      Semiconductor Equipment Corporation, founded in 1975, is a manufacturer and distributor of equipment and solutions for the semiconductor industries, headquartered in California, USA. The company primarily manufactures equipment and processes crucial for producing integrated circuits and electronic devices. Its range of equipment and solutions includes deposition equipment, etching equipment, process tools, and custom solutions. Semiconductor fabrication facilities worldwide use these products and equipment to produce microchips and electronic components used in multiple electronic devices.

    • TDK Corporation.
      • Japan Address: 2-5-1 Nihonbashi, Chuo-ku, Tokyo, Japan

      Manufacturer Overview

      TDK Corporation, established in 1935, is a manufacturer of electronic solutions for the smart society based in Tokyo, Japan. The company is a part of the TDK Group, which has over 250 locations in more than 30 countries worldwide and employs over 103,000 people. They offer a wide range of products, including sensors, power supplies, and magnetic application products. The robotics industry is evolving at a rapid pace, and they are now offering , a robot development platform equipped with a variety of sensors essential to the accurate operation of robots, enabling more efficiency across a wide range of robot development.

      • Japan Address: Ko-58 Mameda-Honmachi, Kanazawa, Ishikawa, Japan

      Manufacturer Overview

      Shibuya Corporation, founded in 1931, is a Japan-based manufacturer and retailer of industrial systems and equipment. Their product portfolio is available in various categories, including packaging plant business, mechatronics, agricultural and regenerative medicine. The packaging plant segment includes various equipment and systems used in the bottling, packaging, food processing and pharmaceutical industries. The agricultural division includes grading & analyzing systems such as fruit, welsh onion, and flowering plant grading systems. The mechatronics system segment includes medical equipment such as dialysis systems, medical lasers, and UV Light treatment systems. The division also includes semiconductor manufacturing and cutting processing systems.

      • Germany Address: Marie-Curie-Str. 6, Regensburg, Bayern, Germany

      Manufacturer Overview

      ASMPT AMICRA GmbH is a German ISO 9001:2015 certified manufacturer of semiconductor assembly and packaging products that was established in Regensburg, Bavaria in 2001. The company various branded products including flip chip bonders for advanced packaging applications (e.g. TCB), die bonders for chip-on-submount, high throughput, and submicron placement accuracy applications. These are used for laser diodes, silicon photonics, automotive sensors, and MEMS. ASMPT AMICRA products are used mainly by clients in optical communication and computing, semiconductors, information technology, and medical device manufacturing.

      • Japan Address: 2-5-1, Kasama, Sakae-ku, Yokohama, Kanagawa, Japan

      Manufacturer Overview

      Shibaura Mechatronics Corporation, established in 1939 and headquartered in Yokohama, Japan, is a manufacturer and supplier of various production equipment. Its product line encompasses FPD manufacturing equipments that include array process, cell process, and module process equipment. ALso offered are semiconductor manufacturing equipment, vacuum equipment, and other equipment used in applications related to manufacturing equipment. The company also develops and manufactures vending machines compatible with numerous electronic payment systems, including credit cards and electronic money.

    • Athlete FA Corporation
      • Japan Address: 2970-1 Shiga, Suwa City, Nagano, Japan

      Manufacturer Overview

      Athlete FA Corporation, founded in 1988 and based in Nagano, Japan, is a manufacturer, designer, and seller of automation equipment. The company offers a wide range of products including Micro ball mounter used in digital devices like smartphones and tablets, flip chip bonders for packaging a broad range of electronics that include Integrated circuits and infrared sensors,, customized machines like aluminum attachment machines, and LCD systems among others. It holds the ISO 9001 and ISO 14001 certifications.

    • Toray Engineering Co., Ltd.

      Manufacturer Overview

      Toray Engineering Co., Ltd., a company founded in the year 1960, based in Tokyo, Japan is a manufacturer and supplier of engineering equipment. The product portfolio includes plant engineering, factory automation, semiconductor-production equipment, FFD- production equipment, film-production equipment, battery production equipment, software, and measuring equipment. The company also provides effective solutions with the latest innovations which include green innovation, life innovation, AI technology, and laser transfer technology. The products are used in multiple industries which include pharmaceutical, fine chemical, film, plant maintenance, and core technologies.

Flip Chip Bonder Manufacturer Ranking

*Including some distributors, etc.

Derivation Method

The ranking is calculated based on the click share within the flip chip bonder page as of February 2024. Click share is defined as the total number of clicks for all companies during the period divided by the number of clicks for each company.

Number of Employees

  1. TDK Corporation.: 116,808

Newly Established Company

  1. Yamaha Motor Corporation, USA: 2011 (13 years ago)
  2. Adwells Co., Ltd.: 2007 (17 years ago)
  3. Athlete FA Corporation: 1988 (36 years ago)

Company with a History

  1. SHIBUYA CORPORATION: 1931 (93 years ago)
  2. TDK Corporation.: 1935 (89 years ago)
  3. Toray Engineering Co., Ltd.: 1960 (64 years ago)

Flip Chip Bonder Manufacturers in United States

*Including some distributors, etc.

Global Distribution of Flip Chip Bonder Manufacturers by Country

*Including some distributors, etc.

Country Number of Companies Share (%)
Japan Japan 5 38.5%
United States of America United States of America 4 30.8%
Germany Germany 1 7.7%
Singapore Singapore 1 7.7%
Republic of Korea Republic of Korea 1 7.7%
France France 1 7.7%

List of Flip Chip Bonder Products

1 product is listed.

Adwells Co., Ltd.

Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)

High accuracy implementation with ultrasonic processes ・ High accuracy implementation with ultrasonic process ・ High -precision positioning func...

1 model listed

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