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History
Response Rate
100.0%
Response Time
125.8hours
Product
Multi-chamber device ENTRONTM N300Handling Company
ULVAC Sales Co., Ltd.Categories
| Image | Part Number | Price (excluding tax) | Electricity | Film thickness/etching distribution*1 | Rough pulling | Energy saving function | Possible process gas system | Transfer room | Transfer robot | Grounding work | Required gas | Board dimensions | Compressed air | Control system | Cooling water | Main exhaust | Process temperature | Pre-clean | Throughput | Spatter | Transfer | Etching for NVM | Module | Load lock | CVD/ALD | Option |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ENTRON N300 |
Available upon quote |
50Hz/60Hz, 3Φ, 200V |
Within Φ300mm board ±5% |
Roughing dry pump, TMP fore dry pump |
Standard equipment |
PVD: up to 4 lines, CVD: up to 14 lines, Etcher: up to 11 lines |
Atmospheric wafer transfer machine + octagonal vacuum transfer chamber |
Dual arm high vacuum transfer robot |
Class A |
Various process gases: 0.1~0.3MPa |
Φ300mm or Φ200mm |
0.5~0.7MPa |
FA-PC control (Cluser Tool controller) |
0.3~0.5MPa, temperature 20~25℃, |
LL room: Dedicated dry pump |
R.T~450℃ |
ICP pre-etching, hydrogen annealing, CDT |
Mechanical throughput: 80wph (transferred twice) |
Sputterdown method/rotating magnet cathode: conventional, LTS, SIS, HiCIS, multi-cathode |
PVD: 1.0×10E-4Pa or less/ETCHER: 10Pa or less |
High temperature, room temperature etching, post treatment for NVM |
PVD: 3.0×10E-6Pa or less/ETCHER: 6.7E-4Pa or less |
10Pa or less |
CVD, CDT for FEOL, BEOL, NVM |
LTS/SIS/Multi-cathode/CVD/ALD/NVM: Etcher module selection available |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
125.8hrs
