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Response Rate
100.0%
Response Time
125.8hours
Product
Sputtering equipment for R&D QAM seriesHandling Company
ULVAC Sales Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | Electricity | Film thickness distribution | Maximum gas introduction amount | Onboard power supply | Exhaust system | Exhaust | Film formation | Compatible board size | Substrate heating mechanism | Compressed air | Ultimate pressure | Processing method | Cooling water | Chamber baking | Target size | Cathode method | Number of cathodes | Earth |
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QAM-4C-S |
Available upon quote |
3φAC200V 50/60Hz |
Within ±5% (combined with substrate rotation during Al film formation) |
1) Max.50sccm (Ar) |
DC500W 1 unit |
1) Turbo pump |
Touch panel (PLC control) Remote manual*3 Fully automatic*4 |
Touch panel (PLC control) Remote manual*3 Fully automatic*4 |
Max.φ4 inch x 1 piece |
Lamp heater Regular use 400℃ *Optional |
0.5~0.7MPa |
1×10-4Pa or less |
Batch type |
20~28℃, specific resistance 5KΩ or more, supply pressure 0.2~0.3MPa |
Bake at 110℃ (chamber water cooling included) *Optional |
Φ2 inch |
Long throw magnetron sputtering |
2 inch cathode (for both magnetic and non-magnetic materials) |
A class, D class |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
125.8hrs