Sputtering equipment for R&D QAM series
ULVAC Sales Co., Ltd.
About This Product
■Summary
This is a device that can be used in a wide range of applications, based on ULVAC's extensive film-forming technology and experience. Achieved miniaturization while providing versatility and expandability. Process chambers and exhaust systems can be freely combined to suit your application.
■Applications
Based on ULVAC's extensive film-forming technology and experience, this low-cost R&D equipment can handle a wide range of functions required for small-scale experimental applications such as all kinds of research and development and material development.
■Can be customized to suit your experiment/research purpose/budget
We have built a unit that can be expanded by incorporating plenty of the technology and know-how we have cultivated over the years. For example, by adding each module to the base machine, it is possible to eventually create a 2-module machine (with L/L room). In addition, you can choose between mechanical and electrical integrated type and control module separated type to suit your layout.
■Achieve advanced functions, intuitive operation, and safety
・Safe and secure with intuitive operation
・Process data can be analyzed with peace of mind (data logging: optional)
・Recipe control enables film formation with good reproducibility
・Stable operation of equipment with interlock equivalent to production equipment
■Low pressure process
It has a discharge sustaining pressure range of approximately 1Pa to 0.1Pa, allowing dense film formation by sputtering at a lower pressure than before.
■Multi-dimensional simultaneous/multi-layer sputter deposition
Because each cathode aims at the center of the substrate, simultaneous multi-source sputtering is possible. Laminated films can be created using shutter control. Also, by using a jig (optional), static counter sputtering is also possible.
■Support for magnetic thin film
The same cathode can be used with various magnetic materials (Fe, Ni, Co, etc.)
■Adoption of LTS
By adopting LTS*1, it is possible to minimize the influence of non-uniform plasma near the cathode on the substrate. It is also possible to minimize the influence of the cathode magnet's magnetic field.
Note) *1: LTS: Long Throw Sputter
■UHV compatible (QAM-4-S only)
By using bakeable equipment, the ultimate pressure in the film forming chamber can be kept below 1 x 10-6Pa*2.
Note) *2: Adopts a double O-ring seal structure (intermediate exhaust), greatly improving maintainability compared to conventional metal seals.
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Product
Sputtering equipment for R&D QAM series
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Handling Company
ULVAC Sales Co., Ltd.
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Categories
1 Models of Sputtering equipment for R&D QAM series
| Product Image | Part Number | Price (excluding tax) | Cathode method | Chamber baking | Compatible board size | Compressed air | Cooling water | Earth | Electricity | Exhaust | Exhaust system | Film formation | Film thickness distribution | Maximum gas introduction amount | Number of cathodes | Onboard power supply | Processing method | Substrate heating mechanism | Target size | Ultimate pressure |
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QAM-4C-S |
Available upon quote |
Long throw magnetron sputtering ・Helicon sputter*1 *Optional |
Bake at 110℃ (chamber water cooling included) *Optional | Max.φ4 inch x 1 piece | 0.5~0.7MPa | 20~28℃, specific resistance 5KΩ or more, supply pressure 0.2~0.3MPa | A class, D class | 3φAC200V 50/60Hz |
Touch panel (PLC control) Remote manual*3 Fully automatic*4 *3: Manual/semi-automatic operation from touch panel *4: Recipes such as power and time can be input using the touch panel. |
1) Turbo pump 2) Rotary pump Dry pump *Optional |
Touch panel (PLC control) Remote manual*3 Fully automatic*4 *3: Manual/semi-automatic operation from touch panel *4: Recipes such as power and time can be input using the touch panel. |
Within ±5% (combined with substrate rotation during Al film formation) |
1) Max.50sccm (Ar) 2) Max.10sccm (O2) 3) Max.10sccm (N2) |
2 inch cathode (for both magnetic and non-magnetic materials) Up to 4 units can be installed |
DC500W 1 unit ・DC500W, RF300W*2 can be selected, and up to 2 units can be installed *Optional |
Batch type | Lamp heater Regular use 400℃ *Optional | Φ2 inch | 1×10-4Pa or less |
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About Company Handling This Product
- Japan