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  4. Plating Technology for 3D-MID (KEDC CO.,LTD.)
Plating Technology for 3D-MID-Plating Technology for 3D-MID
Plating Technology for 3D-MID-KEDC CO.,LTD.

Plating Technology for 3D-MID
KEDC CO.,LTD.

About This Product

■Surface Treatment Features

3D-MID* is a technology that forms three-dimensional circuits on resin molded parts through plating. Plating is possible on molded parts made of general resin materials (resins not containing catalytic metals). *3D-MID = 3-dimensional Molded Interconnect Device

■Surface Treatment Overview

Compatible materials: General resin materials (liquid crystal polymer; please contact us for others.) Metallizing treatment on laser-processed areas (Plating specification examples: Ch-Cu 5μm~ / Ch-Ni 3μm~ / Ch-Au 0.05μm) L/S* down to 100μm/100μm is supported. *Abbreviation for line/space: the width of lines (circuits) and spaces (gaps between circuits)

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    Plating Technology for 3D-MID

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1 Models of Plating Technology for 3D-MID

Image Part Number Price (excluding tax) Compatible Materials
Plating Technology for 3D-MID-Part Number-Plating Technology for 3D-MID

Plating Technology for 3D-MID

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General resin materials (liquid crystal polymer, others)

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About Company Handling This Product

KEDC CO.,LTD.

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