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  4. Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder) (Adwells Co., Ltd.)
Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)-Ultrasonic high precision flip chip bonda
Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)-Adwells Co., Ltd.

Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)
Adwells Co., Ltd.

Adwells Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

126.6hours

About This Product

High accuracy implementation with ultrasonic processes ・ High accuracy implementation with ultrasonic process ・ High -precision positioning function ・ High quality bonding ・ Detailed joint conditions setting

■ Same species / hydrophiled metal joining

Difficult metal joining is possible with normal welding. The materials are directly joined at room temperature without using soldering.

■ Infrared image sensor (COOL BOND)

Combined the Kyushu University's sharp bump and ultrasonic junction to realize 300,000 bumps at room temperature.

  • Product

    Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)

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1 Models of Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)

Image Part Number Price (excluding tax)
Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)-Part Number-Ultrasonic high precision flip chip bonda

Ultrasonic high precision flip chip bonda

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About Company Handling This Product

Adwells Co., Ltd.

Response Rate

100.0%

Response Time

126.6hrs

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Adwells Co., Ltd.
Adwells Co., Ltd.

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