Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)
Adwells Co., Ltd.
About This Product
High accuracy implementation with ultrasonic processes
・ High accuracy implementation with ultrasonic process
・ High -precision positioning function
・ High quality bonding
・ Detailed joint conditions setting
■ Same species / hydrophiled metal joining
Difficult metal joining is possible with normal welding. The materials are directly joined at room temperature without using soldering.
■ Infrared image sensor (COOL BOND)
Combined the Kyushu University's sharp bump and ultrasonic junction to realize 300,000 bumps at room temperature.
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Product
Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)
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Handling Company
Adwells Co., Ltd.
1 Models of Ultrasonic high accuracy flip chip bonder (US Precision Flip Chip Bonder)
| Product Image | Part Number | Price (excluding tax) |
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Ultrasonic high precision flip chip bonda |
Available upon quote |
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About Company Handling This Product
- Japan
- Since 2007