IGBT Module joining device (Ultrasonic Metal Bonder)
Adwells Co., Ltd.
About This Product
Ultrasonic joining system ideal for power device production
・ Flexible production
・ Resistant to terminal floating
・ Color image processing
■ Same species / hydrophiled metal joining
Difficult metal joining is possible with normal welding. The materials are directly joined at room temperature without using soldering.
■ IGBT module (terminal joining)
In the IGBT module where the operating temperature rises, it is desirable to do not use soldering. By ultrasound, the package side lead and the DBC substrate electrode are directly joined.
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Product
IGBT Module joining device (Ultrasonic Metal Bonder)
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Handling Company
Adwells Co., Ltd.
1 Models of IGBT Module joining device (Ultrasonic Metal Bonder)
| Product Image | Part Number | Price (excluding tax) |
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IGBT module joining device |
Available upon quote |
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About Company Handling This Product
- Japan
- Since 2007