Ideal for next -generation power device circuit formation
・ Flexible production by head replacement
・ Equipped with multi -feeder corresponding to heterogeneous materials
・ Job to vulnerable materials
・ Equipped with color image processing
■ Same species / hydrophiled metal joining
Difficult metal joining is possible with normal welding. The materials are directly joined at room temperature without using soldering.
■ IGBT module (ribbon bonding)
CU Ribbon bonding realizes a large -class circuit.
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