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Attotive pressure (direct) Plasma device in the liquid DKN-128-DKN-128
Attotive pressure (direct) Plasma device in the liquid DKN-128-SAKIGAKE-Semiconductor

Attotive pressure (direct) Plasma device in the liquid DKN-128
SAKIGAKE-Semiconductor

SAKIGAKE-Semiconductor's Response Status

Response Rate

100.0%

Response Time

120.0hours


About This Product

■ Product overview

・ Improvement of diversification of powder by plasma in the liquid ・ We will improve production efficiency by continuous processing. ・ Plasma processing while crushing aggregation with impact ・ For plating preprocessing to the powder

  • Product

    Attotive pressure (direct) Plasma device in the liquid DKN-128

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1 Models of Attotive pressure (direct) Plasma device in the liquid DKN-128

Image Part Number Price (excluding tax) External dimensions
Attotive pressure (direct) Plasma device in the liquid DKN-128-Part Number-DKN-128

DKN-128

Available upon quote

(W) 685mm x (d) 425mm x (H) 440mm

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About Company Handling This Product

Response Rate

100.0%


Response Time

120.0hrs

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