High-density plasma dry etching equipment ULHITETM NE-7800H-ULHITETM NE-7800H
High-density plasma dry etching equipment ULHITETM NE-7800H-ULVAC Sales Co., Ltd.

High-density plasma dry etching equipment ULHITETM NE-7800H
ULVAC Sales Co., Ltd.


About This Product

■Summary The high-density plasma dry etching system ULHITETM NE-7800H is a multi-chamber type low-pressure, high-density plasma that is compatible with etching difficult-to-etch materials (ferroelectrics, noble metals, magnetic films, etc.) used in FeRAM, MRAM, ReRAM, PCRAM, etc. This is an etching device. ■Applications FeRAM, MRAM, ReRAM, CBRAM, PcRAM, etc. ■Features ・Magnetic field ICP (ISM) method - dedicated machine for processing non-volatile materials using low-pressure, high-density plasma ・Providing etching solutions ranging from room temperature to high temperature (400°C) laminated film batch etching and hard mask removal. - Measures against deposits by uniform heating from chamber to exhaust line to DRP. ・Mass production equipment with extensive experience in etching non-volatile materials, including structures, materials, and heating mechanisms that reduce maintenance and cleaning costs and particle generation. ・Achieves long-term reproducibility and stability.

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    High-density plasma dry etching equipment ULHITETM NE-7800H

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1 Models of High-density plasma dry etching equipment ULHITETM NE-7800H

Product Image Part Number Price (excluding tax) Deposition measures Device configuration Film type In-plane uniformity Plasma source Process recipe editing method Processable substrate size Substrate electrode temperature
High-density plasma dry etching equipment ULHITETM NE-7800H-Part Number-ULHITETM NE-7800H

ULHITETM NE-7800H

Available upon quote Faraday shield mechanism/top plate heating mechanism/anti-adhesion plate heating mechanism, etc. Cassette chamber/autoloader
Transfer room
etching chamber
Preheating chamber (optional)
Pre/post treatment room (optional)
Ferroelectric/high dielectric materials, magnetic materials, electrode materials, etc. ±5% or less ISM (Magnetic ICP) Multi-step method 6/8 inches ~400℃±5℃

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