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  4. High-density plasma dry etching equipment ULHITETM NE-7800H (ULVAC Sales Co., Ltd.)
High-density plasma dry etching equipment ULHITETM NE-7800H-ULHITETM NE-7800H
High-density plasma dry etching equipment ULHITETM NE-7800H-ULVAC Sales Co., Ltd.

High-density plasma dry etching equipment ULHITETM NE-7800H
ULVAC Sales Co., Ltd.

ULVAC Sales Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

125.8hours

About This Product

■Summary

The high-density plasma dry etching system ULHITETM NE-7800H is a multi-chamber type low-pressure, high-density plasma that is compatible with etching difficult-to-etch materials (ferroelectrics, noble metals, magnetic films, etc.) used in FeRAM, MRAM, ReRAM, PCRAM, etc. This is an etching device.

■Applications

FeRAM, MRAM, ReRAM, CBRAM, PcRAM, etc.

■Features

・Magnetic field ICP (ISM) method - dedicated machine for processing non-volatile materials using low-pressure, high-density plasma ・Providing etching solutions ranging from room temperature to high temperature (400°C) laminated film batch etching and hard mask removal. - Measures against deposits by uniform heating from chamber to exhaust line to DRP. ・Mass production equipment with extensive experience in etching non-volatile materials, including structures, materials, and heating mechanisms that reduce maintenance and cleaning costs and particle generation. ・Achieves long-term reproducibility and stability.

  • Product

    High-density plasma dry etching equipment ULHITETM NE-7800H

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1 Models of High-density plasma dry etching equipment ULHITETM NE-7800H

Image Part Number Price (excluding tax) In-plane uniformity Device configuration Film type Substrate electrode temperature Processable substrate size Process recipe editing method Plasma source Deposition measures
High-density plasma dry etching equipment ULHITETM NE-7800H-Part Number-ULHITETM NE-7800H

ULHITETM NE-7800H

Available upon quote

±5% or less

Cassette chamber/autoloader
Transfer room
etching chamber
Preheating chamber (optional)
Pre/post treatment room (optional)

Ferroelectric/high dielectric materials, magnetic materials, electrode materials, etc.

~400℃±5℃

6/8 inches

Multi-step method

ISM (Magnetic ICP)

Faraday shield mechanism/top plate heating mechanism/anti-adhesion plate heating mechanism, etc.

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About Company Handling This Product

ULVAC Sales Co., Ltd.

Response Rate

100.0%

Response Time

125.8hrs

  • Japan

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