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  4. Batch type natural oxide film removal equipment RISETM-300 (ULVAC Sales Co., Ltd.)
Batch type natural oxide film removal equipment RISETM-300-RISETM-300
Batch type natural oxide film removal equipment RISETM-300-ULVAC Sales Co., Ltd.

Batch type natural oxide film removal equipment RISETM-300
ULVAC Sales Co., Ltd.

ULVAC Sales Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

125.8hours

About This Product

■Summary

The batch type natural oxide film removal device RISETM-300 is a batch type pre-clean device that can remove difficult natural oxide films such as those from the bottom of deep-contact LSIs. We have a lineup of target wafers of 200mm and 300mm.

■Applications

・Pre-treatment when forming self-aligned contacts ・Pretreatment during capacitor formation ・Pretreatment during epitaxial growth ・Pretreatment of Co (Ni) salicide

■Features

・Achieving high throughput and low CoO ・Good etching uniformity (<±5%/batch) and reproducibility ・Dry process ・Damage free (remote plasma and low temperature process) ・Reduced resistance of self-aligned contact to 1/2 that of conventional wet process ・Flexible equipment layout ・Emphasis on maintainability (side maintenance free) ・Batch processing of 50 300mm wafers at once

  • Product

    Batch type natural oxide film removal equipment RISETM-300

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Last viewed: 18 hours ago

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1 Models of Batch type natural oxide film removal equipment RISETM-300

Image Part Number Price (excluding tax) Device configuration Nitrogen gas Exhaust system Exhaust main unit Exhaust pump rack exhaust Exhaust Gas box exhaust (combustion supporting gas side) Exhaust Gas box exhaust (combustible gas side) Board stage Board size Compressed air Control system Cooling water for this machine Cooling water for DRP/chiller Main power supply 2 Main power supply 1 Pump rack Process gas Plasma source Gas introduction system Application
Batch type natural oxide film removal equipment RISETM-300-Part Number-RISETM-300

RISETM-300

Available upon quote

EFEM+LL+PM

0.6~0.9MPa

Mechanical booster pump + DRP

20m3/min

10.5m3/min

0.3m3/min

2.0m3/min

Ceramic boat (50 pieces/batch)

Φ300mm

0.4~0.7MPa

FAPC+TFT touch panel

0.2~0.5MPa
Water temperature 20~25℃
Flow rate 20L/min x 2 systems

0.2~0.5MPa
Water temperature 20~25℃
Flow rate 15L/min

AC±208V, 50/60Hz, 3φ83A, 28.6kVA

AC±208V, 50/60Hz, 3φ118A, 41kVA

AC200V, 50/60Hz, 3φ86.5A, 30kVA

0.6~0.9MPa

Microwave power supply

3 systems

Pretreatment for SAC, capacitor, and epitaxial growth salicide formation

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About Company Handling This Product

ULVAC Sales Co., Ltd.

Response Rate

100.0%

Response Time

125.8hrs

  • Japan

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