Batch type natural oxide film removal equipment RISETM-300-RISETM-300
Batch type natural oxide film removal equipment RISETM-300-ULVAC Sales Co., Ltd.

Batch type natural oxide film removal equipment RISETM-300
ULVAC Sales Co., Ltd.


About This Product

■Summary The batch type natural oxide film removal device RISETM-300 is a batch type pre-clean device that can remove difficult natural oxide films such as those from the bottom of deep-contact LSIs. We have a lineup of target wafers of 200mm and 300mm. ■Applications ・Pre-treatment when forming self-aligned contacts ・Pretreatment during capacitor formation ・Pretreatment during epitaxial growth ・Pretreatment of Co (Ni) salicide ■Features ・Achieving high throughput and low CoO ・Good etching uniformity (<±5%/batch) and reproducibility ・Dry process ・Damage free (remote plasma and low temperature process) ・Reduced resistance of self-aligned contact to 1/2 that of conventional wet process ・Flexible equipment layout ・Emphasis on maintainability (side maintenance free) ・Batch processing of 50 300mm wafers at once

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    Batch type natural oxide film removal equipment RISETM-300

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1 Models of Batch type natural oxide film removal equipment RISETM-300

Product Image Part Number Price (excluding tax) Application Board size Board stage Compressed air Control system Cooling water for DRP/chiller Cooling water for this machine Device configuration Exhaust Gas box exhaust (combustible gas side) Exhaust Gas box exhaust (combustion supporting gas side) Exhaust main unit Exhaust pump rack exhaust Exhaust system Gas introduction system Main power supply 1 Main power supply 2 Nitrogen gas Plasma source Process gas Pump rack
Batch type natural oxide film removal equipment RISETM-300-Part Number-RISETM-300

RISETM-300

Available upon quote Pretreatment for SAC, capacitor, and epitaxial growth salicide formation Φ300mm Ceramic boat (50 pieces/batch) 0.4~0.7MPa FAPC+TFT touch panel 0.2~0.5MPa
Water temperature 20~25℃
Flow rate 15L/min
0.2~0.5MPa
Water temperature 20~25℃
Flow rate 20L/min x 2 systems
EFEM+LL+PM 2.0m3/min 0.3m3/min 20m3/min 10.5m3/min Mechanical booster pump + DRP 3 systems AC±208V, 50/60Hz, 3φ118A, 41kVA AC±208V, 50/60Hz, 3φ83A, 28.6kVA 0.6~0.9MPa Microwave power supply 0.6~0.9MPa AC200V, 50/60Hz, 3φ86.5A, 30kVA

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